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Flat package inductance extraction with ground plane current precalculation

Gunther Lippens and Daniël De Zutter UGent Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. p.221-224
Please use this url to cite or link to this publication:
author
organization
type
conference
publication status
published
subject
in
Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA
pages
221-224 pages
language
English
UGent publication?
yes
classification
C1
id
143759
handle
http://hdl.handle.net/1854/LU-143759
date created
2004-01-14 13:38:00
date last changed
2016-12-19 15:35:49
@inproceedings{143759,
  author       = {Lippens, Gunther and De Zutter, Dani{\"e}l},
  booktitle    = {Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA},
  language     = {eng},
  pages        = {221--224},
  title        = {Flat package inductance extraction with ground plane current precalculation},
}

Chicago
Lippens, Gunther, and Daniël De Zutter. “Flat Package Inductance Extraction with Ground Plane Current Precalculation.” In Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA, 221–224.
APA
Lippens, Gunther, & De Zutter, D. (n.d.). Flat package inductance extraction with ground plane current precalculation. Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA (pp. 221–224).
Vancouver
1.
Lippens G, De Zutter D. Flat package inductance extraction with ground plane current precalculation. Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. p. 221–4.
MLA
Lippens, Gunther, and Daniël De Zutter. “Flat Package Inductance Extraction with Ground Plane Current Precalculation.” Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. 221–224. Print.