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Chicago
Lippens, Gunther, and Daniël De Zutter. “Flat Package Inductance Extraction with Ground Plane Current Precalculation.” In Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA, 221–224.
APA
Lippens, Gunther, & De Zutter, D. (n.d.). Flat package inductance extraction with ground plane current precalculation. Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA (pp. 221–224).
Vancouver
1.
Lippens G, De Zutter D. Flat package inductance extraction with ground plane current precalculation. Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. p. 221–4.
MLA
Lippens, Gunther, and Daniël De Zutter. “Flat Package Inductance Extraction with Ground Plane Current Precalculation.” Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA. 221–224. Print.
@inproceedings{143759,
  author       = {Lippens, Gunther and De Zutter, Dani{\"e}l},
  booktitle    = {Proceedings of the IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2001), October 29-31, 2001, Cambridge, Massachusetts, USA},
  language     = {eng},
  pages        = {221--224},
  title        = {Flat package inductance extraction with ground plane current precalculation},
}