Ghent University Academic Bibliography

Advanced

The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin films

Qi Xie UGent, Yu-Long Jiang, Koen De Keyser UGent, Christophe Detavernier UGent, Davy Deduytsche UGent, Guo-Ping Ru, Xin-Ping Qu and KN Tu (2010) MICROELECTRONIC ENGINEERING. 87(12). p.2535-2539
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
Copper film, Agglomeration, Diffusion barrier, Twin, METALLIZATION, CU FILMS
journal title
MICROELECTRONIC ENGINEERING
Microelectron. Eng.
volume
87
issue
12
pages
2535 - 2539
Web of Science type
Article
Web of Science id
000282206100016
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
1.569 (2010)
JCR rank
66/247 (2010)
JCR quartile
2 (2010)
ISSN
0167-9317
DOI
10.1016/j.mee.2010.06.015
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1226863
handle
http://hdl.handle.net/1854/LU-1226863
date created
2011-05-18 17:47:38
date last changed
2011-05-20 10:29:26
@article{1226863,
  author       = {Xie, Qi and Jiang, Yu-Long and De Keyser, Koen and Detavernier, Christophe and Deduytsche, Davy and Ru, Guo-Ping and Qu, Xin-Ping and Tu, KN},
  issn         = {0167-9317},
  journal      = {MICROELECTRONIC ENGINEERING},
  keyword      = {Copper film,Agglomeration,Diffusion barrier,Twin,METALLIZATION,CU FILMS},
  language     = {eng},
  number       = {12},
  pages        = {2535--2539},
  title        = {The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin films},
  url          = {http://dx.doi.org/10.1016/j.mee.2010.06.015},
  volume       = {87},
  year         = {2010},
}

Chicago
Xie, Qi, Yu-Long Jiang, Koen De Keyser, Christophe Detavernier, Davy Deduytsche, Guo-Ping Ru, Xin-Ping Qu, and KN Tu. 2010. “The Effect of Sputtered W-based Carbide Diffusion Barriers on the Thermal Stability and Void Formation in Copper Thin Films.” Microelectronic Engineering 87 (12): 2535–2539.
APA
Xie, Q., Jiang, Y.-L., De Keyser, K., Detavernier, C., Deduytsche, D., Ru, G.-P., Qu, X.-P., et al. (2010). The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin films. MICROELECTRONIC ENGINEERING, 87(12), 2535–2539.
Vancouver
1.
Xie Q, Jiang Y-L, De Keyser K, Detavernier C, Deduytsche D, Ru G-P, et al. The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin films. MICROELECTRONIC ENGINEERING. 2010;87(12):2535–9.
MLA
Xie, Qi, Yu-Long Jiang, Koen De Keyser, et al. “The Effect of Sputtered W-based Carbide Diffusion Barriers on the Thermal Stability and Void Formation in Copper Thin Films.” MICROELECTRONIC ENGINEERING 87.12 (2010): 2535–2539. Print.