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Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper

David Schaubroeck (UGent) , Johan De Baets (UGent) , Tim Desmet (UGent) , Peter Dubruel (UGent) , Etienne Schacht (UGent) , Luc Van Vaeck and André Van Calster (UGent)
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Abstract
The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion with electrochemically deposited metals. In this article, first cyanuric chloride is covalently bound to the surface hydroxyl groups of the epoxy resin. The remaining reactive sites on the coupled cyanuric chloride molecule are the used to anchor polyamines. The surface reactions are monitored and characterized by means of ATR-IR, SEM-EDS, XPS and ToF-SIMS.

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Chicago
Schaubroeck, David, Johan De Baets, Tim Desmet, Peter Dubruel, Etienne Schacht, Luc Van Vaeck, and André Van Calster. 2011. “Chemical Modification of a Photo Definable Epoxy Resin with Polyamines to Improve Adhesion with Electroless Deposited Copper.” In Proceedings of the Twenty Fourth International Conference on Surface Modification Technologies, ed. TS Sudarshan, Eckhard Beyer, and Lutz-Michael Berger, 339–351. Valardocs.
APA
Schaubroeck, D., De Baets, J., Desmet, T., Dubruel, P., Schacht, E., Van Vaeck, L., & Van Calster, A. (2011). Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper. In T. Sudarshan, E. Beyer, & L.-M. Berger (Eds.), Proceedings of the twenty fourth international conference on surface modification technologies (pp. 339–351). Presented at the Surface Modification Technologies XXIV, Valardocs.
Vancouver
1.
Schaubroeck D, De Baets J, Desmet T, Dubruel P, Schacht E, Van Vaeck L, et al. Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper. In: Sudarshan T, Beyer E, Berger L-M, editors. Proceedings of the twenty fourth international conference on surface modification technologies. Valardocs; 2011. p. 339–51.
MLA
Schaubroeck, David, Johan De Baets, Tim Desmet, et al. “Chemical Modification of a Photo Definable Epoxy Resin with Polyamines to Improve Adhesion with Electroless Deposited Copper.” Proceedings of the Twenty Fourth International Conference on Surface Modification Technologies. Ed. TS Sudarshan, Eckhard Beyer, & Lutz-Michael Berger. Valardocs, 2011. 339–351. Print.
@inproceedings{1220731,
  abstract     = {The presence of polyamine groups on the surface of dielectrics potentially improves the adhesion with electrochemically deposited metals. In this article, first cyanuric chloride is covalently bound to the surface hydroxyl groups of the epoxy resin. The remaining reactive sites on the coupled cyanuric chloride molecule are the used to anchor polyamines. The surface reactions are monitored and characterized by means of ATR-IR, SEM-EDS, XPS and ToF-SIMS.},
  author       = {Schaubroeck, David and De Baets, Johan and Desmet, Tim and Dubruel, Peter and Schacht, Etienne and Van Vaeck, Luc and Van Calster, Andr{\'e}},
  booktitle    = {Proceedings of the twenty fourth international conference on surface modification technologies},
  editor       = {Sudarshan, TS and Beyer, Eckhard and Berger, Lutz-Michael},
  isbn         = {9788191057126},
  language     = {eng},
  location     = {Dresden, Germany},
  pages        = {339--351},
  publisher    = {Valardocs},
  title        = {Chemical modification of a photo definable epoxy resin with polyamines to improve adhesion with electroless deposited copper},
  year         = {2011},
}