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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

(2011) THIN SOLID FILMS. 519(7). p.2225-2234
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Keywords
CIRCUITS, ELECTRONICS, Cohesive failure, Stretchable device, Interfacial delamination

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Citation

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Chicago
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, and Ingrid De Wolf. 2011. “The Effects of Encapsulation on Deformation Behavior and Failure Mechanisms of Stretchable Interconnects.” Thin Solid Films 519 (7): 2225–2234.
APA
Hsu, Y. Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., & De Wolf, I. (2011). The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects. THIN SOLID FILMS, 519(7), 2225–2234.
Vancouver
1.
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, De Wolf I. The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects. THIN SOLID FILMS. 2011;519(7):2225–34.
MLA
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, et al. “The Effects of Encapsulation on Deformation Behavior and Failure Mechanisms of Stretchable Interconnects.” THIN SOLID FILMS 519.7 (2011): 2225–2234. Print.
@article{1218365,
  author       = {Hsu, Yung Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and De Wolf, Ingrid},
  journal      = {THIN SOLID FILMS},
  keyword      = {CIRCUITS,ELECTRONICS,Cohesive failure,Stretchable device,Interfacial delamination},
  language     = {eng},
  number       = {7},
  pages        = {2225--2234},
  title        = {The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects},
  volume       = {519},
  year         = {2011},
}

Web of Science
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