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The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt UGent, Fabrice Axisa, Jan Vanfleteren UGent and Ingrid De Wolf (2011) THIN SOLID FILMS. 519(7). p.2225-2234
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
CIRCUITS, ELECTRONICS, Cohesive failure, Stretchable device, Interfacial delamination
journal title
THIN SOLID FILMS
Thin Solid Films
volume
519
issue
7
pages
2225 - 2234
Web of Science type
Article
Web of Science id
000287543300032
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1218365
handle
http://hdl.handle.net/1854/LU-1218365
date created
2011-05-05 16:40:01
date last changed
2016-12-19 15:46:38
@article{1218365,
  author       = {Hsu, Yung Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and De Wolf, Ingrid},
  journal      = {THIN SOLID FILMS},
  keyword      = {CIRCUITS,ELECTRONICS,Cohesive failure,Stretchable device,Interfacial delamination},
  language     = {eng},
  number       = {7},
  pages        = {2225--2234},
  title        = {The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects},
  volume       = {519},
  year         = {2011},
}

Chicago
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, and Ingrid De Wolf. 2011. “The Effects of Encapsulation on Deformation Behavior and Failure Mechanisms of Stretchable Interconnects.” Thin Solid Films 519 (7): 2225–2234.
APA
Hsu, Y. Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., & De Wolf, I. (2011). The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects. THIN SOLID FILMS, 519(7), 2225–2234.
Vancouver
1.
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, De Wolf I. The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects. THIN SOLID FILMS. 2011;519(7):2225–34.
MLA
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, et al. “The Effects of Encapsulation on Deformation Behavior and Failure Mechanisms of Stretchable Interconnects.” THIN SOLID FILMS 519.7 (2011): 2225–2234. Print.