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Adsorption/desorption of suppressor complex on copper: description of the critical potential

Tanya Atanasova UGent, Katrien Strubbe UGent and Philippe M Vereecken (2011) ECS Transactions. 33(37). p.13-26
abstract
The acid cupric sulfate solutions, used for Damascene copper plating, contain several additives which provide the differential deposition rate inside cavities for void-free fill. Most of the models for this process, available in the literature, can successfully predict trends. However, these models miss fines as they are based on physical adsorption only. Since the copper surface has a complex chemistry, a physicochemical approach is needed to describe all the reaction mechanisms involved. In this work we provide some further insight into the thermodynamics of copper deposition inhibition by the suppressor polymer. The quantitative participation of each solution component is discussed and the adsorption/desorption reaction for the suppression is balanced based on the achieved results. In addition, a value for the standard critical potential was obtained which made possible the solubility constant for the Cu(I)-Suppressor-Cl complex to be estimated.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
supressor, electrodeposition, damascene plating
in
ECS Transactions
ECS Trans.
editor
E Podlaha
volume
33
issue
37
issue title
Molecular structure of the solid-liquid interface and its relationship to electrodeposition 7
pages
13 - 26
publisher
Electrochemical Society (ECS)
place of publication
St Pennington, NJ, USA
conference name
218th ECS Meeting ; Symposium on Nanotechnology General Session ; Symposium on Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7
conference location
Las Vegas, NV, USA
conference start
2010-10-10
conference end
2010-10-15
Web of Science type
Proceedings Paper
Web of Science id
000300573600002
ISSN
1938-5862
ISBN
9781607682479
DOI
10.1149/1.3576072
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1215941
handle
http://hdl.handle.net/1854/LU-1215941
date created
2011-05-02 19:02:53
date last changed
2013-04-08 13:16:39
@inproceedings{1215941,
  abstract     = {The acid cupric sulfate solutions, used for Damascene copper plating, contain several additives which provide the differential deposition rate inside cavities for void-free fill. Most of the models for this process, available in the literature, can successfully predict trends. However, these models miss fines as they are based on physical adsorption only. Since the copper surface has a complex chemistry, a physicochemical approach is needed to describe all the reaction mechanisms involved. In this work we provide some further insight into the thermodynamics of copper deposition inhibition by the suppressor polymer. The quantitative participation of each solution component is discussed and the
adsorption/desorption reaction for the suppression is balanced based on the achieved results. In addition, a value for the standard critical potential was obtained which made possible the solubility constant for the Cu(I)-Suppressor-Cl complex to be estimated.},
  author       = {Atanasova, Tanya and Strubbe, Katrien and Vereecken, Philippe M},
  booktitle    = {ECS Transactions},
  editor       = {Podlaha, E},
  isbn         = {9781607682479},
  issn         = {1938-5862},
  keyword      = {supressor,electrodeposition,damascene plating},
  language     = {eng},
  location     = {Las Vegas, NV, USA},
  number       = {37},
  pages        = {13--26},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Adsorption/desorption of suppressor complex on copper: description of the critical potential},
  url          = {http://dx.doi.org/10.1149/1.3576072},
  volume       = {33},
  year         = {2011},
}

Chicago
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. 2011. “Adsorption/desorption of Suppressor Complex on Copper: Description of the Critical Potential.” In ECS Transactions, ed. E Podlaha, 33:13–26. St Pennington, NJ, USA: Electrochemical Society (ECS).
APA
Atanasova, T., Strubbe, K., & Vereecken, P. M. (2011). Adsorption/desorption of suppressor complex on copper: description of the critical potential. In E. Podlaha (Ed.), ECS Transactions (Vol. 33, pp. 13–26). Presented at the 218th ECS Meeting ; Symposium on Nanotechnology General Session ; Symposium on Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition 7, St Pennington, NJ, USA: Electrochemical Society (ECS).
Vancouver
1.
Atanasova T, Strubbe K, Vereecken PM. Adsorption/desorption of suppressor complex on copper: description of the critical potential. In: Podlaha E, editor. ECS Transactions. St Pennington, NJ, USA: Electrochemical Society (ECS); 2011. p. 13–26.
MLA
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. “Adsorption/desorption of Suppressor Complex on Copper: Description of the Critical Potential.” ECS Transactions. Ed. E Podlaha. Vol. 33. St Pennington, NJ, USA: Electrochemical Society (ECS), 2011. 13–26. Print.