Advanced search
1 file | 674.32 KB

Packaging technology enabling flexible optical interconnections

Erwin Bosman (UGent) , Geert Van Steenberge (UGent) , Jeroen Missinne (UGent) , Bram Van Hoe (UGent) , Sandeep Kalathimekkad (UGent) and Peter Van Daele (UGent)
Author
Organization
Project
FAOS
Abstract
This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.
Keywords
Packaging technology enabling flexible optical interconnections

Downloads

  • 7944-13 Erwin Bosman.pdf
    • full text
    • |
    • open access
    • |
    • PDF
    • |
    • 674.32 KB

Citation

Please use this url to cite or link to this publication:

Chicago
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad, and Peter Van Daele. 2011. “Packaging Technology Enabling Flexible Optical Interconnections.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Alexei L Glebov and Ray T Chen. Vol. 7944. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
APA
Bosman, E., Van Steenberge, G., Missinne, J., Van Hoe, B., Kalathimekkad, S., & Van Daele, P. (2011). Packaging technology enabling flexible optical interconnections. In A. L. Glebov & R. T. Chen (Eds.), Proceedings of SPIE, the International Society for Optical Engineering (Vol. 7944). Presented at the Conference on Optoelectronic Interconnects and Component Integration XI, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Bosman E, Van Steenberge G, Missinne J, Van Hoe B, Kalathimekkad S, Van Daele P. Packaging technology enabling flexible optical interconnections. In: Glebov AL, Chen RT, editors. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2011.
MLA
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, et al. “Packaging Technology Enabling Flexible Optical Interconnections.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. Alexei L Glebov & Ray T Chen. Vol. 7944. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2011. Print.
@inproceedings{1199734,
  abstract     = {This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.},
  articleno    = {79440E},
  author       = {Bosman, Erwin and Van Steenberge, Geert and Missinne, Jeroen and Van Hoe, Bram and Kalathimekkad, Sandeep and Van Daele, Peter},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Glebov, Alexei L and Chen, Ray T},
  isbn         = {9780819484819},
  issn         = {0277-786X},
  keyword      = {Packaging technology enabling flexible optical interconnections},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  pages        = {9},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Packaging technology enabling flexible optical interconnections},
  url          = {http://dx.doi.org/10.1117/12.874959},
  volume       = {7944},
  year         = {2011},
}

Altmetric
View in Altmetric
Web of Science
Times cited: