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Packaging technology enabling flexible optical interconnections

Erwin Bosman UGent, Geert Van Steenberge UGent, Jeroen Missinne UGent, Bram Van Hoe UGent, Sandeep Kalathimekkad UGent and Peter Van Daele UGent (2011) Proceedings of SPIE, the International Society for Optical Engineering. 7944.
abstract
This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
Packaging technology enabling flexible optical interconnections
in
Proceedings of SPIE, the International Society for Optical Engineering
Proc. SPIE Int. Soc. Opt. Eng.
editor
Alexei L Glebov and Ray T Chen
volume
7944
issue title
Optoelectronic interconnects and component integration XI
article_number
79440E
pages
9 pages
publisher
SPIE, the International Society for Optical Engineering
place of publication
Bellingham, WA, USA
conference name
Conference on Optoelectronic Interconnects and Component Integration XI
conference location
San Francisco, CA, USA
conference start
2011-01-24
conference end
2011-01-26
Web of Science type
Proceedings Paper
Web of Science id
000298241900012
ISSN
0277-786X
ISBN
9780819484819
DOI
10.1117/12.874959
project
FAOS
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1199734
handle
http://hdl.handle.net/1854/LU-1199734
date created
2011-03-30 17:20:49
date last changed
2012-12-03 16:01:46
@inproceedings{1199734,
  abstract     = {This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.},
  articleno    = {79440E},
  author       = {Bosman, Erwin and Van Steenberge, Geert and Missinne, Jeroen and Van Hoe, Bram and Kalathimekkad, Sandeep and Van Daele, Peter},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Glebov, Alexei L and Chen, Ray T},
  isbn         = {9780819484819},
  issn         = {0277-786X},
  keyword      = {Packaging technology enabling flexible optical interconnections},
  language     = {eng},
  location     = {San Francisco, CA, USA},
  pages        = {9},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {Packaging technology enabling flexible optical interconnections},
  url          = {http://dx.doi.org/10.1117/12.874959},
  volume       = {7944},
  year         = {2011},
}

Chicago
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad, and Peter Van Daele. 2011. “Packaging Technology Enabling Flexible Optical Interconnections.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. Alexei L Glebov and Ray T Chen. Vol. 7944. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
APA
Bosman, E., Van Steenberge, G., Missinne, J., Van Hoe, B., Kalathimekkad, S., & Van Daele, P. (2011). Packaging technology enabling flexible optical interconnections. In A. L. Glebov & R. T. Chen (Eds.), Proceedings of SPIE, the International Society for Optical Engineering (Vol. 7944). Presented at the Conference on Optoelectronic Interconnects and Component Integration XI, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Bosman E, Van Steenberge G, Missinne J, Van Hoe B, Kalathimekkad S, Van Daele P. Packaging technology enabling flexible optical interconnections. In: Glebov AL, Chen RT, editors. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2011.
MLA
Bosman, Erwin, Geert Van Steenberge, Jeroen Missinne, et al. “Packaging Technology Enabling Flexible Optical Interconnections.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. Alexei L Glebov & Ray T Chen. Vol. 7944. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2011. Print.