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Physicochemical mechanism of Damascene copper plating : effect of suppressor

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Please use this url to cite or link to this publication:

MLA
Atanasova, Tanya, et al. “Physicochemical Mechanism of Damascene Copper Plating : Effect of Suppressor.” Electrochemical Society, 216th Meeting, Abstracts, 2009.
APA
Atanasova, T., Strubbe, K., & Vereecken, P. M. (2009). Physicochemical mechanism of Damascene copper plating : effect of suppressor. In Electrochemical Society, 216th Meeting, Abstracts. Vienna, Austria.
Chicago author-date
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. 2009. “Physicochemical Mechanism of Damascene Copper Plating : Effect of Suppressor.” In Electrochemical Society, 216th Meeting, Abstracts.
Chicago author-date (all authors)
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. 2009. “Physicochemical Mechanism of Damascene Copper Plating : Effect of Suppressor.” In Electrochemical Society, 216th Meeting, Abstracts.
Vancouver
1.
Atanasova T, Strubbe K, Vereecken PM. Physicochemical mechanism of Damascene copper plating : effect of suppressor. In: Electrochemical Society, 216th Meeting, Abstracts. 2009.
IEEE
[1]
T. Atanasova, K. Strubbe, and P. M. Vereecken, “Physicochemical mechanism of Damascene copper plating : effect of suppressor,” in Electrochemical Society, 216th Meeting, Abstracts, Vienna, Austria, 2009.
@inproceedings{1178030,
  articleno    = {abstract 2708},
  author       = {Atanasova, Tanya and Strubbe, Katrien and Vereecken, Philippe M},
  booktitle    = {Electrochemical Society, 216th Meeting, Abstracts},
  language     = {eng},
  location     = {Vienna, Austria},
  title        = {Physicochemical mechanism of Damascene copper plating : effect of suppressor},
  year         = {2009},
}