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Physicochemical mechanism of Damascene copper plating: effect of suppressor

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Chicago
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. 2009. “Physicochemical Mechanism of Damascene Copper Plating: Effect of Suppressor.” In Electrochemical Society, 216th Meeting, Abstracts.
APA
Atanasova, T., Strubbe, K., & Vereecken, P. M. (2009). Physicochemical mechanism of Damascene copper plating: effect of suppressor. Electrochemical Society, 216th Meeting, Abstracts. Presented at the 216th Meeting of the Electrochemical Society (216th ECS meeting).
Vancouver
1.
Atanasova T, Strubbe K, Vereecken PM. Physicochemical mechanism of Damascene copper plating: effect of suppressor. Electrochemical Society, 216th Meeting, Abstracts. 2009.
MLA
Atanasova, Tanya, Katrien Strubbe, and Philippe M Vereecken. “Physicochemical Mechanism of Damascene Copper Plating: Effect of Suppressor.” Electrochemical Society, 216th Meeting, Abstracts. 2009. Print.
@inproceedings{1178030,
  articleno    = {abstract 2708},
  author       = {Atanasova, Tanya and Strubbe, Katrien and Vereecken, Philippe M},
  booktitle    = {Electrochemical Society, 216th Meeting, Abstracts},
  language     = {eng},
  location     = {Vienna, Austria},
  title        = {Physicochemical mechanism of Damascene copper plating: effect of suppressor},
  year         = {2009},
}