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Tailoring copper island density for copper plating on a RuTa substrate

Magi Margalit Nagar, Philippe Vereecken, Alexandar Radisic and Katrien Strubbe UGent (2010) ECS Transactions. 28(29). p.9-16
abstract
The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition parameters. High island density was achieved with higher applied current, addition of suppressor and low copper concentration in the plating bath.
Please use this url to cite or link to this publication:
author
organization
year
type
conference (proceedingsPaper)
publication status
published
subject
keyword
additive free solution, nucleation copper, RuTa
in
ECS Transactions
ECS Trans.
editor
H Deligianni , J Harb, J Fenton , K Hebert and V Subramanian
volume
28
issue
29
issue title
Electrochemical engineering for the 21st century : dedicated to Richard C. Alkire
pages
9 - 16
publisher
Electrochemical Society (ECS)
place of publication
Pennington, NJ, USA
conference name
217th ECS Meeting
conference location
Vancouver, BC, Canada
conference start
2010-04-25
conference end
2010-04-30
Web of Science type
Proceedings Paper
Web of Science id
000313618500002
ISSN
1938-5862
ISBN
9781566778558
DOI
10.1149/1.3502439
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1177706
handle
http://hdl.handle.net/1854/LU-1177706
date created
2011-02-28 23:19:08
date last changed
2018-01-29 12:12:33
@inproceedings{1177706,
  abstract     = {The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition parameters. High island density was achieved with higher applied current, addition of suppressor and low copper concentration in the plating bath.},
  author       = {Nagar, Magi Margalit and Vereecken, Philippe and Radisic, Alexandar and Strubbe, Katrien},
  booktitle    = {ECS Transactions},
  editor       = {Deligianni , H and  Harb, J and   Fenton , J and Hebert, K and Subramanian , V},
  isbn         = {9781566778558},
  issn         = {1938-5862},
  keyword      = {additive free solution,nucleation copper,RuTa},
  language     = {eng},
  location     = {Vancouver, BC, Canada},
  number       = {29},
  pages        = {9--16},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Tailoring copper island density for copper plating on a RuTa substrate},
  url          = {http://dx.doi.org/10.1149/1.3502439},
  volume       = {28},
  year         = {2010},
}

Chicago
Nagar, Magi Margalit, Philippe Vereecken, Alexandar Radisic, and Katrien Strubbe. 2010. “Tailoring Copper Island Density for Copper Plating on a RuTa Substrate.” In ECS Transactions, ed. H Deligianni , J Harb, J   Fenton , K Hebert, and V Subramanian , 28:9–16. Pennington, NJ, USA: Electrochemical Society (ECS).
APA
Nagar, M. M., Vereecken, P., Radisic, A., & Strubbe, K. (2010). Tailoring copper island density for copper plating on a RuTa substrate. In H. Deligianni , J. Harb, J.   Fenton , K. Hebert, & V. Subramanian (Eds.), ECS Transactions (Vol. 28, pp. 9–16). Presented at the 217th ECS Meeting, Pennington, NJ, USA: Electrochemical Society (ECS).
Vancouver
1.
Nagar MM, Vereecken P, Radisic A, Strubbe K. Tailoring copper island density for copper plating on a RuTa substrate. In: Deligianni H, Harb J,   Fenton J, Hebert K, Subramanian V, editors. ECS Transactions. Pennington, NJ, USA: Electrochemical Society (ECS); 2010. p. 9–16.
MLA
Nagar, Magi Margalit, Philippe Vereecken, Alexandar Radisic, et al. “Tailoring Copper Island Density for Copper Plating on a RuTa Substrate.” ECS Transactions. Ed. H Deligianni et al. Vol. 28. Pennington, NJ, USA: Electrochemical Society (ECS), 2010. 9–16. Print.