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Tailoring copper island density for copper plating on a RuTa substrate

(2010) ECS Transactions. 28(29). p.9-16
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Abstract
The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition parameters. High island density was achieved with higher applied current, addition of suppressor and low copper concentration in the plating bath.
Keywords
additive free solution, nucleation copper, RuTa

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Citation

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Chicago
Nagar, Magi Margalit, Philippe Vereecken, Alexandar Radisic, and Katrien Strubbe. 2010. “Tailoring Copper Island Density for Copper Plating on a RuTa Substrate.” In ECS Transactions, ed. H Deligianni , J Harb, J   Fenton , K Hebert, and V Subramanian , 28:9–16. Pennington, NJ, USA: Electrochemical Society (ECS).
APA
Nagar, M. M., Vereecken, P., Radisic, A., & Strubbe, K. (2010). Tailoring copper island density for copper plating on a RuTa substrate. In H. Deligianni , J. Harb, J.   Fenton , K. Hebert, & V. Subramanian (Eds.), ECS Transactions (Vol. 28, pp. 9–16). Presented at the 217th ECS Meeting, Pennington, NJ, USA: Electrochemical Society (ECS).
Vancouver
1.
Nagar MM, Vereecken P, Radisic A, Strubbe K. Tailoring copper island density for copper plating on a RuTa substrate. In: Deligianni H, Harb J,   Fenton J, Hebert K, Subramanian V, editors. ECS Transactions. Pennington, NJ, USA: Electrochemical Society (ECS); 2010. p. 9–16.
MLA
Nagar, Magi Margalit, Philippe Vereecken, Alexandar Radisic, et al. “Tailoring Copper Island Density for Copper Plating on a RuTa Substrate.” ECS Transactions. Ed. H Deligianni et al. Vol. 28. Pennington, NJ, USA: Electrochemical Society (ECS), 2010. 9–16. Print.
@inproceedings{1177706,
  abstract     = {The electrochemical nucleation and growth of copper on a ruthenium-tantalum (RuTa) alloy has been studied using galvanostatic methods. The experimental results show that the island density is highly dependent on the bath composition and deposition parameters. High island density was achieved with higher applied current, addition of suppressor and low copper concentration in the plating bath.},
  author       = {Nagar, Magi Margalit and Vereecken, Philippe and Radisic, Alexandar and Strubbe, Katrien},
  booktitle    = {ECS Transactions},
  editor       = {Deligianni , H and  Harb, J and   Fenton , J and Hebert, K and Subramanian , V},
  isbn         = {9781566778558},
  issn         = {1938-5862},
  keyword      = {additive free solution,nucleation copper,RuTa},
  language     = {eng},
  location     = {Vancouver, BC, Canada},
  number       = {29},
  pages        = {9--16},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Tailoring copper island density for copper plating on a RuTa substrate},
  url          = {http://dx.doi.org/10.1149/1.3502439},
  volume       = {28},
  year         = {2010},
}

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