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Copper plating on resistive substrates, diffusion barrier and alternative seed layers

A Radisic, Magi Margalit Nagar, Katrien Strubbe UGent, S Armini, Z El-Mekki, H Volders, W Ruythooren and PM Vereecken (2010) ECS Transactions. 25(27). p.175-184
abstract
We have studied electrochemical deposition of copper on ruthenium-tantalum (Ru-Ta) alloy, tantalum (Ta), and cobalt (Co) substrates using cyclic voltammetry and galvanostatic methods. We show that a single-step direct-plating from acidic Cu bath approach is favorable on thin Ru-Ta films, while it presents a significant challenge for plating on resistive Ta and Co substrates.
Please use this url to cite or link to this publication:
author
organization
year
type
conference (proceedingsPaper)
publication status
published
subject
keyword
RU, ELECTRODEPOSITION, CU
in
ECS Transactions
ECS Trans.
editor
G Oskam, P Vereecken, I Shao and J Fransaer
volume
25
issue
27
issue title
Semiconductors, metal oxides, and composites : metallization and electrodeposition of thin films and nanostructures
pages
175 - 184
publisher
Electrochemical Society (ECS)
place of publication
Pennington, NJ, USA
conference name
216th ECS Meeting
conference location
Vienna, Austria
conference start
2009-10-04
conference end
2009-10-09
Web of Science type
Proceedings Paper
Web of Science id
000319358700018
ISSN
1938-5862
ISBN
9781566778008
DOI
10.1149/1.3318516
language
English
UGent publication?
yes
classification
P1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1177460
handle
http://hdl.handle.net/1854/LU-1177460
date created
2011-02-28 22:10:53
date last changed
2018-01-29 12:12:33
@inproceedings{1177460,
  abstract     = {We have studied electrochemical deposition of copper on ruthenium-tantalum (Ru-Ta) alloy, tantalum (Ta), and cobalt (Co) substrates using cyclic voltammetry and galvanostatic methods. We show that a single-step direct-plating from acidic Cu bath approach is favorable on thin Ru-Ta films, while it presents a significant challenge for plating on resistive Ta and Co substrates.},
  author       = {Radisic, A and Nagar, Magi Margalit and Strubbe, Katrien and Armini, S and El-Mekki, Z and Volders, H and Ruythooren, W and Vereecken, PM},
  booktitle    = {ECS Transactions},
  editor       = {Oskam, G and Vereecken, P and  Shao, I and  Fransaer , J},
  isbn         = {9781566778008},
  issn         = {1938-5862},
  keyword      = {RU,ELECTRODEPOSITION,CU},
  language     = {eng},
  location     = {Vienna, Austria},
  number       = {27},
  pages        = {175--184},
  publisher    = {Electrochemical Society (ECS)},
  title        = {Copper plating on resistive substrates, diffusion barrier and alternative seed layers},
  url          = {http://dx.doi.org/10.1149/1.3318516},
  volume       = {25},
  year         = {2010},
}

Chicago
Radisic, A, Magi Margalit Nagar, Katrien Strubbe, S Armini, Z El-Mekki, H Volders, W Ruythooren, and PM Vereecken. 2010. “Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers.” In ECS Transactions, ed. G Oskam, P Vereecken, I Shao, and J Fransaer , 25:175–184. Pennington, NJ, USA: Electrochemical Society (ECS).
APA
Radisic, A., Nagar, M. M., Strubbe, K., Armini, S., El-Mekki, Z., Volders, H., Ruythooren, W., et al. (2010). Copper plating on resistive substrates, diffusion barrier and alternative seed layers. In G. Oskam, P. Vereecken, I. Shao, & J. Fransaer (Eds.), ECS Transactions (Vol. 25, pp. 175–184). Presented at the 216th ECS Meeting, Pennington, NJ, USA: Electrochemical Society (ECS).
Vancouver
1.
Radisic A, Nagar MM, Strubbe K, Armini S, El-Mekki Z, Volders H, et al. Copper plating on resistive substrates, diffusion barrier and alternative seed layers. In: Oskam G, Vereecken P, Shao I, Fransaer J, editors. ECS Transactions. Pennington, NJ, USA: Electrochemical Society (ECS); 2010. p. 175–84.
MLA
Radisic, A, Magi Margalit Nagar, Katrien Strubbe, et al. “Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers.” ECS Transactions. Ed. G Oskam et al. Vol. 25. Pennington, NJ, USA: Electrochemical Society (ECS), 2010. 175–184. Print.