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A new approach to flip chip on board technology using SMT compatible processes.

Suixin Zhang, Johan De Baets UGent and André Van Calster UGent (1999) MICROELECTRONICS INTERNATIONAL. 16(3). p.39-42
Please use this url to cite or link to this publication:
author
organization
year
type
misc
publication status
published
subject
in
MICROELECTRONICS INTERNATIONAL
volume
16
issue
3
pages
39-42 pages
language
English
UGent publication?
yes
classification
U
id
117588
handle
http://hdl.handle.net/1854/LU-117588
date created
2004-01-14 13:35:00
date last changed
2016-12-19 15:41:24
@misc{117588,
  author       = {Zhang, Suixin and De Baets, Johan and Van Calster, Andr{\'e}},
  language     = {eng},
  number       = {3},
  pages        = {39--42},
  series       = {MICROELECTRONICS INTERNATIONAL},
  title        = {A new approach to flip chip on board technology using SMT compatible processes.},
  volume       = {16},
  year         = {1999},
}

Chicago
Zhang, Suixin, Johan De Baets, and André Van Calster. 1999. “A New Approach to Flip Chip on Board Technology Using SMT Compatible Processes.” Microelectronics International.
APA
Zhang, Suixin, De Baets, J., & Van Calster, A. (1999). A new approach to flip chip on board technology using SMT compatible processes. MICROELECTRONICS INTERNATIONAL.
Vancouver
1.
Zhang S, De Baets J, Van Calster A. A new approach to flip chip on board technology using SMT compatible processes. MICROELECTRONICS INTERNATIONAL. 1999. p. 39–42.
MLA
Zhang, Suixin, Johan De Baets, and André Van Calster. “A New Approach to Flip Chip on Board Technology Using SMT Compatible Processes.” MICROELECTRONICS INTERNATIONAL 1999 : 39–42. Print.