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A new approach to flip chip on board technology using SMT compatible processes.

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Chicago
Zhang, Suixin, Johan De Baets, and André Van Calster. 1999. “A New Approach to Flip Chip on Board Technology Using SMT Compatible Processes.” Microelectronics International.
APA
Zhang, Suixin, De Baets, J., & Van Calster, A. (1999). A new approach to flip chip on board technology using SMT compatible processes. MICROELECTRONICS INTERNATIONAL.
Vancouver
1.
Zhang S, De Baets J, Van Calster A. A new approach to flip chip on board technology using SMT compatible processes. MICROELECTRONICS INTERNATIONAL. 1999. p. 39–42.
MLA
Zhang, Suixin, Johan De Baets, and André Van Calster. “A New Approach to Flip Chip on Board Technology Using SMT Compatible Processes.” MICROELECTRONICS INTERNATIONAL 1999 : 39–42. Print.
@misc{117588,
  author       = {Zhang, Suixin and De Baets, Johan and Van Calster, Andr{\'e}},
  language     = {eng},
  number       = {3},
  pages        = {39--42},
  series       = {MICROELECTRONICS INTERNATIONAL},
  title        = {A new approach to flip chip on board technology using SMT compatible processes.},
  volume       = {16},
  year         = {1999},
}