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Chicago
BORN, I, D DETEMMERMAN, Johan De Baets, and André Van Calster. 1999. “Low Cost High-Density Multilayer Circuits for MCM-C.” In Proceedings of the 5th European Conference on MultiChip Modules, Imaps-UK, London, Februari 1999, 21–26.
APA
BORN, I., DETEMMERMAN, D., De Baets, J., & Van Calster, A. (1999). Low Cost High-Density Multilayer Circuits for MCM-C. Proceedings of the 5th European Conference on MultiChip Modules, Imaps-UK, London, februari 1999 (pp. 21–26).
Vancouver
1.
BORN I, DETEMMERMAN D, De Baets J, Van Calster A. Low Cost High-Density Multilayer Circuits for MCM-C. Proceedings of the 5th European Conference on MultiChip Modules, Imaps-UK, London, februari 1999. 1999. p. 21–6.
MLA
BORN, I, D DETEMMERMAN, Johan De Baets, et al. “Low Cost High-Density Multilayer Circuits for MCM-C.” Proceedings of the 5th European Conference on MultiChip Modules, Imaps-UK, London, Februari 1999. 1999. 21–26. Print.
@inproceedings{117334,
  author       = {BORN, I and DETEMMERMAN, D and De Baets, Johan and Van Calster, André},
  booktitle    = {Proceedings of the 5th European Conference on MultiChip Modules, Imaps-UK, London, februari 1999},
  language     = {eng},
  pages        = {21--26},
  title        = {Low Cost High-Density Multilayer Circuits for MCM-C.},
  year         = {1999},
}