Academic Bibliography

 Search 200 years of publications by Ghent University researchers.
Advanced search
  1. Search results
  2. Mixed component integration in advanc...

Mixed component integration in advanced printed wiring boards

S O'REILLY, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens (UGent) and S PAYNE
(1999) The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Author
Organization

Citation

Please use this url to cite or link to this publication:

Chicago
O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
APA
O’REILLY, S., DUFFY, M., MATHUNA, S., RAEDSCHELDERS, E., Corlatan, D., Madou, A., Martens, L., et al. (1999). Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Vancouver
1.
O’REILLY S, DUFFY M, MATHUNA S, RAEDSCHELDERS E, Corlatan D, Madou A, et al. Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999.
MLA
O’REILLY, S, M DUFFY, SC MATHUNA, et al. “Mixed Component Integration in Advanced Printed Wiring Boards.” The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999. Print.
@inproceedings{117172,
  author       = {O'REILLY, S and DUFFY, M and MATHUNA, SC and RAEDSCHELDERS, E and Corlatan, Dorina and Madou, An and Martens, Luc and PAYNE, S},
  booktitle    = {The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom},
  language     = {eng},
  title        = {Mixed component integration in advanced printed wiring boards},
  year         = {1999},
}