Mixed component integration in advanced printed wiring boards

O'REILLY, S; DUFFY, M; MATHUNA, SC; RAEDSCHELDERS, E; Corlatan, Dorina; Madou, An; Martens, Luc; PAYNE, S

Mixed component integration in advanced printed wiring boards

S O'REILLY, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens UGent and S PAYNE (1999) The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.

Mark

Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-117172

author

S O'REILLY, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens UGent and S PAYNE

organization

year

1999

type

conference

publication status

published

subject

Technology and Engineering

in

The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom

language

English

UGent publication?

yes

classification

id

117172

handle

http://hdl.handle.net/1854/LU-117172

date created

2004-01-14 13:35:00

date last changed

2016-12-19 15:36:13

@inproceedings{117172,
  author       = {O'REILLY, S and DUFFY, M and MATHUNA, SC and RAEDSCHELDERS, E and Corlatan, Dorina and Madou, An and Martens, Luc and PAYNE, S},
  booktitle    = {The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom},
  language     = {eng},
  title        = {Mixed component integration in advanced printed wiring boards},
  year         = {1999},
}

Chicago: O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
APA: O’REILLY, S., DUFFY, M., MATHUNA, S., RAEDSCHELDERS, E., Corlatan, D., Madou, A., Martens, L., et al. (1999). Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Vancouver: 1.
O’REILLY S, DUFFY M, MATHUNA S, RAEDSCHELDERS E, Corlatan D, Madou A, et al. Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999.
MLA: O’REILLY, S, M DUFFY, SC MATHUNA, et al. “Mixed Component Integration in Advanced Printed Wiring Boards.” The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999. Print.