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Chicago
O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
APA
O’REILLY, S., DUFFY, M., MATHUNA, S., RAEDSCHELDERS, E., Corlatan, D., Madou, A., Martens, L., et al. (1999). Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Vancouver
1.
O’REILLY S, DUFFY M, MATHUNA S, RAEDSCHELDERS E, Corlatan D, Madou A, et al. Mixed component integration in advanced printed wiring boards. The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999.
MLA
O’REILLY, S, M DUFFY, SC MATHUNA, et al. “Mixed Component Integration in Advanced Printed Wiring Boards.” The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999. Print.
@inproceedings{117172,
  author       = {O'REILLY, S and DUFFY, M and MATHUNA, SC and RAEDSCHELDERS, E and Corlatan, Dorina and Madou, An and Martens, Luc and PAYNE, S},
  booktitle    = {The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom},
  language     = {eng},
  title        = {Mixed component integration in advanced printed wiring boards},
  year         = {1999},
}