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MLA
O’REILLY, S., et al. “Mixed Component Integration in Advanced Printed Wiring Boards.” The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom, 1999.
APA
O’REILLY, S., DUFFY, M., MATHUNA, S., RAEDSCHELDERS, E., Corlatan, D., Madou, A., … PAYNE, S. (1999). Mixed component integration in advanced printed wiring boards. In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Chicago author-date
O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Chicago author-date (all authors)
O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
Vancouver
1.
O’REILLY S, DUFFY M, MATHUNA S, RAEDSCHELDERS E, Corlatan D, Madou A, et al. Mixed component integration in advanced printed wiring boards. In: The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999.
IEEE
[1]
S. O’REILLY et al., “Mixed component integration in advanced printed wiring boards,” in The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom, 1999.
@inproceedings{117172,
  author       = {{O'REILLY, S and DUFFY, M and MATHUNA, SC and RAEDSCHELDERS, E and Corlatan, Dorina and Madou, An and Martens, Luc and PAYNE, S}},
  booktitle    = {{The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom}},
  language     = {{eng}},
  title        = {{Mixed component integration in advanced printed wiring boards}},
  year         = {{1999}},
}