
Mixed component integration in advanced printed wiring boards
- Author
- S O'REILLY, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens (UGent) and S PAYNE
- Organization
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-117172
- MLA
- O’REILLY, S., et al. “Mixed Component Integration in Advanced Printed Wiring Boards.” The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom, 1999.
- APA
- O’REILLY, S., DUFFY, M., MATHUNA, S., RAEDSCHELDERS, E., Corlatan, D., Madou, A., … PAYNE, S. (1999). Mixed component integration in advanced printed wiring boards. In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
- Chicago author-date
- O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
- Chicago author-date (all authors)
- O’REILLY, S, M DUFFY, SC MATHUNA, E RAEDSCHELDERS, Dorina Corlatan, An Madou, Luc Martens, and S PAYNE. 1999. “Mixed Component Integration in Advanced Printed Wiring Boards.” In The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom.
- Vancouver
- 1.O’REILLY S, DUFFY M, MATHUNA S, RAEDSCHELDERS E, Corlatan D, Madou A, et al. Mixed component integration in advanced printed wiring boards. In: The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom. 1999.
- IEEE
- [1]S. O’REILLY et al., “Mixed component integration in advanced printed wiring boards,” in The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom, 1999.
@inproceedings{117172, author = {{O'REILLY, S and DUFFY, M and MATHUNA, SC and RAEDSCHELDERS, E and Corlatan, Dorina and Madou, An and Martens, Luc and PAYNE, S}}, booktitle = {{The Fifth European Conference on MultiChip Modules (EC-MCM 99), International Microelectronics and Packaging Society - UK (IMAPS-UK), 1-2 February London, United Kingdom}}, language = {{eng}}, title = {{Mixed component integration in advanced printed wiring boards}}, year = {{1999}}, }