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Circuit modelling of high-density electronic packaging(Invited paper).

Luc Martens UGent (1999) Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy. p.551-554
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy
pages
551-554 pages
language
English
UGent publication?
yes
classification
C1
id
117072
handle
http://hdl.handle.net/1854/LU-117072
date created
2004-01-14 13:35:00
date last changed
2016-12-19 15:35:36
@inproceedings{117072,
  author       = {Martens, Luc},
  booktitle    = {Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy},
  language     = {eng},
  pages        = {551--554},
  title        = {Circuit modelling of high-density electronic packaging(Invited paper).},
  year         = {1999},
}

Chicago
Martens, Luc. 1999. “Circuit Modelling of High-density Electronic packaging(Invited Paper).” In Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy, 551–554.
APA
Martens, Luc. (1999). Circuit modelling of high-density electronic packaging(Invited paper). Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy (pp. 551–554).
Vancouver
1.
Martens L. Circuit modelling of high-density electronic packaging(Invited paper). Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy. 1999. p. 551–4.
MLA
Martens, Luc. “Circuit Modelling of High-density Electronic packaging(Invited Paper).” Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy. 1999. 551–554. Print.