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Chicago
Martens, Luc. 1999. “Circuit Modelling of High-density Electronic packaging(Invited Paper).” In Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy, 551–554.
APA
Martens, Luc. (1999). Circuit modelling of high-density electronic packaging(Invited paper). Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy (pp. 551–554).
Vancouver
1.
Martens L. Circuit modelling of high-density electronic packaging(Invited paper). Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy. 1999. p. 551–4.
MLA
Martens, Luc. “Circuit Modelling of High-density Electronic packaging(Invited Paper).” Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy. 1999. 551–554. Print.
@inproceedings{117072,
  author       = {Martens, Luc},
  booktitle    = {Proceedings of the European Conference on Circuit Theory and Design (ECCTD 99), Vol. 1, 29 August - 2 September 1999, Stresa, Italy},
  language     = {eng},
  pages        = {551--554},
  title        = {Circuit modelling of high-density electronic packaging(Invited paper).},
  year         = {1999},
}