Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-1154931

MLA

Stanković, Stevan, et al. “Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devices.” ECS Transactions, edited by C Colinge et al., vol. 33, no. 4, Electrochemical Society (ECS), 2010, pp. 411–20, doi:10.1149/1.3483531.

APA

Stanković, S., Van Thourhout, D., Roelkens, G., Jones, R., Heck, J., & Sysak, M. (2010). Die-to-die adhesive bonding for evanescently-coupled photonic devices. In C. Colinge, J. Bagdahn, H. Baumgart, K. Hobart, H. Moriceau, & T. Suga (Eds.), ECS Transactions (Vol. 33, pp. 411–420). https://doi.org/10.1149/1.3483531

Chicago author-date

Stanković, Stevan, Dries Van Thourhout, Günther Roelkens, R Jones, J Heck, and M Sysak. 2010. “Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devices.” In ECS Transactions, edited by C Colinge, J Bagdahn, H Baumgart, K Hobart, H Moriceau, and T Suga, 33:411–20. Pennington, NJ, USA: Electrochemical Society (ECS). https://doi.org/10.1149/1.3483531.

Chicago author-date (all authors)

Stanković, Stevan, Dries Van Thourhout, Günther Roelkens, R Jones, J Heck, and M Sysak. 2010. “Die-to-Die Adhesive Bonding for Evanescently-Coupled Photonic Devices.” In ECS Transactions, ed by. C Colinge, J Bagdahn, H Baumgart, K Hobart, H Moriceau, and T Suga, 33:411–420. Pennington, NJ, USA: Electrochemical Society (ECS). doi:10.1149/1.3483531.

Vancouver

1.

Stanković S, Van Thourhout D, Roelkens G, Jones R, Heck J, Sysak M. Die-to-die adhesive bonding for evanescently-coupled photonic devices. In: Colinge C, Bagdahn J, Baumgart H, Hobart K, Moriceau H, Suga T, editors. ECS Transactions. Pennington, NJ, USA: Electrochemical Society (ECS); 2010. p. 411–20.

IEEE

[1]

S. Stanković, D. Van Thourhout, G. Roelkens, R. Jones, J. Heck, and M. Sysak, “Die-to-die adhesive bonding for evanescently-coupled photonic devices,” in ECS Transactions, Las Vegas, NV, USA, 2010, vol. 33, no. 4, pp. 411–420.