III-V/silicon photonics for on-chip and inter-chip optical interconnects
- Author
- Günther Roelkens (UGent) , Liu Liu (UGent) , Di Liang, Richard Jones, Alexander Fang, Brian Koch and John Bowers
- Organization
- Keywords
- III-V photonics, Silicon photonics, wafer bonding, optical interconnect, SILICON EVANESCENT LASER, BENZOCYCLOBUTENE-BONDED WAFERS, CRITICAL ADHESION ENERGY, LOW-TEMPERATURE, HETEROGENEOUS INTEGRATION, MULTICARRIER SOURCE, INJECTION LOCKING, MICRODISK LASERS, WAVE-GUIDE, INSULATOR
Downloads
-
(...).pdf
- full text
- |
- UGent only
- |
- |
- 7.38 MB
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-1154808
- MLA
- Roelkens, Günther, et al. “III-V/Silicon Photonics for on-Chip and Inter-Chip Optical Interconnects.” LASER & PHOTONICS REVIEWS, vol. 4, no. 6, 2010, pp. 751–79, doi:10.1002/lpor.200900033.
- APA
- Roelkens, G., Liu, L., Liang, D., Jones, R., Fang, A., Koch, B., & Bowers, J. (2010). III-V/silicon photonics for on-chip and inter-chip optical interconnects. LASER & PHOTONICS REVIEWS, 4(6), 751–779. https://doi.org/10.1002/lpor.200900033
- Chicago author-date
- Roelkens, Günther, Liu Liu, Di Liang, Richard Jones, Alexander Fang, Brian Koch, and John Bowers. 2010. “III-V/Silicon Photonics for on-Chip and Inter-Chip Optical Interconnects.” LASER & PHOTONICS REVIEWS 4 (6): 751–79. https://doi.org/10.1002/lpor.200900033.
- Chicago author-date (all authors)
- Roelkens, Günther, Liu Liu, Di Liang, Richard Jones, Alexander Fang, Brian Koch, and John Bowers. 2010. “III-V/Silicon Photonics for on-Chip and Inter-Chip Optical Interconnects.” LASER & PHOTONICS REVIEWS 4 (6): 751–779. doi:10.1002/lpor.200900033.
- Vancouver
- 1.Roelkens G, Liu L, Liang D, Jones R, Fang A, Koch B, et al. III-V/silicon photonics for on-chip and inter-chip optical interconnects. LASER & PHOTONICS REVIEWS. 2010;4(6):751–79.
- IEEE
- [1]G. Roelkens et al., “III-V/silicon photonics for on-chip and inter-chip optical interconnects,” LASER & PHOTONICS REVIEWS, vol. 4, no. 6, pp. 751–779, 2010.
@article{1154808,
author = {{Roelkens, Günther and Liu, Liu and Liang, Di and Jones, Richard and Fang, Alexander and Koch, Brian and Bowers, John}},
issn = {{1863-8880}},
journal = {{LASER & PHOTONICS REVIEWS}},
keywords = {{III-V photonics,Silicon photonics,wafer bonding,optical interconnect,SILICON EVANESCENT LASER,BENZOCYCLOBUTENE-BONDED WAFERS,CRITICAL ADHESION ENERGY,LOW-TEMPERATURE,HETEROGENEOUS INTEGRATION,MULTICARRIER SOURCE,INJECTION LOCKING,MICRODISK LASERS,WAVE-GUIDE,INSULATOR}},
language = {{eng}},
number = {{6}},
pages = {{751--779}},
title = {{III-V/silicon photonics for on-chip and inter-chip optical interconnects}},
url = {{http://doi.org/10.1002/lpor.200900033}},
volume = {{4}},
year = {{2010}},
}
- Altmetric
- View in Altmetric
- Web of Science
- Times cited: