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200 mm wafer scale III-V/SOI technology for all-optical network-on-chip and signal processing

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Abstract
Integrated components, including microdisk lasers, photodetectors, and wavelength selective circuits, for optical network-on-chip and all-optical signal processing are presented using a complementary metal-oxide-semiconductor compatible III-V/silicon-on-insulator integration technology at 200mm wafer scale.
Keywords
photodetectors, silicon-on-insulator, optical information processing, network-on-chip, microdisc lasers, integrated optics, CMOS integrated circuits, III-V semiconductors, wafer bonding, wafer-scale integration

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Citation

Please use this url to cite or link to this publication:

Chicago
Liu, Liu, Thijs Spuesens, Dries Van Thourhout, Geert Morthier, L Grenouillet, N Olivier, JM Fedeli, et al. 2010. “200 Mm Wafer Scale III-V/SOI Technology for All-optical Network-on-chip and Signal Processing.” In 2010 7th IEEE International Conference on Group IV Photonics, 7–9. Piscataway, NJ, USA: IEEE.
APA
Liu, Liu, Spuesens, T., Van Thourhout, D., Morthier, G., Grenouillet, L., Olivier, N., Fedeli, J., et al. (2010). 200 mm wafer scale III-V/SOI technology for all-optical network-on-chip and signal processing. 2010 7th IEEE International conference on group IV photonics (pp. 7–9). Presented at the IEEE International Conference on Group IV Photonics, Piscataway, NJ, USA: IEEE.
Vancouver
1.
Liu L, Spuesens T, Van Thourhout D, Morthier G, Grenouillet L, Olivier N, et al. 200 mm wafer scale III-V/SOI technology for all-optical network-on-chip and signal processing. 2010 7th IEEE International conference on group IV photonics. Piscataway, NJ, USA: IEEE; 2010. p. 7–9.
MLA
Liu, Liu, Thijs Spuesens, Dries Van Thourhout, et al. “200 Mm Wafer Scale III-V/SOI Technology for All-optical Network-on-chip and Signal Processing.” 2010 7th IEEE International Conference on Group IV Photonics. Piscataway, NJ, USA: IEEE, 2010. 7–9. Print.
@inproceedings{1150629,
  abstract     = {Integrated components, including microdisk lasers, photodetectors, and wavelength selective circuits, for optical network-on-chip and all-optical signal processing are presented using a complementary metal-oxide-semiconductor compatible III-V/silicon-on-insulator integration technology at 200mm wafer scale.},
  author       = {Liu, Liu and Spuesens, Thijs and Van Thourhout, Dries and Morthier, Geert and Grenouillet, L and Olivier, N and Fedeli, JM and Rojo-Romeo, P and Regreny, P and Mandorlo, F and Orobtchouk, R},
  booktitle    = {2010 7th IEEE International conference on group IV photonics},
  isbn         = {9781424463442},
  issn         = {1949-2081},
  language     = {eng},
  location     = {Beijing, PR China},
  pages        = {7--9},
  publisher    = {IEEE},
  title        = {200 mm wafer scale III-V/SOI technology for all-optical network-on-chip and signal processing},
  url          = {http://dx.doi.org/10.1109/GROUP4.2010.5643444},
  year         = {2010},
}

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