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The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards

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Abstract
The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOM-generation of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.
Keywords
silicon photonics, photonic routers, photonic integrated circuits, Silicon-on-insulator, hybrid integration, PHOTODETECTOR, all-optical wavelength converters

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MLA
Stampoulidis, Leontios, Konstantinos Vyrsokinos, Christos Stamatiadis, et al. “The BOOM Project: a New Generation of Photonic Routing Subsystems Using Hybrid Integration on Silicon-on-insulator Waveguide Boards.” Proceedings of SPIE, the International Society for Optical Engineering. Ed. GC Righini. Vol. 7719. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering, 2010. Print.
APA
Stampoulidis, Leontios, Vyrsokinos, K., Stamatiadis, C., Avramopoulos, H., Zimmerman, L., Voigt, K., Sheng, Z., et al. (2010). The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards. In G. Righini (Ed.), Proceedings of SPIE, the International Society for Optical Engineering (Vol. 7719). Presented at the Conference on Silicon Photonics and Photonic Integrated Circuits II, Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date
Stampoulidis, Leontios, Konstantinos Vyrsokinos, Christos Stamatiadis, Hercules Avramopoulos, Lars Zimmerman, Karsten Voigt, Zhen Sheng, et al. 2010. “The BOOM Project: a New Generation of Photonic Routing Subsystems Using Hybrid Integration on Silicon-on-insulator Waveguide Boards.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. GC Righini. Vol. 7719. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Chicago author-date (all authors)
Stampoulidis, Leontios, Konstantinos Vyrsokinos, Christos Stamatiadis, Hercules Avramopoulos, Lars Zimmerman, Karsten Voigt, Zhen Sheng, Dries Van Thourhout, Jochen Kreissl, Ludwig Morl, Jens Bolten, Thorsten Wahlbrink, Fausto Gomez-Agis, Eduward Tangdiongga, Harmen JS Dorren, Annachiara Pagano, and Emilio Riccardi. 2010. “The BOOM Project: a New Generation of Photonic Routing Subsystems Using Hybrid Integration on Silicon-on-insulator Waveguide Boards.” In Proceedings of SPIE, the International Society for Optical Engineering, ed. GC Righini. Vol. 7719. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering.
Vancouver
1.
Stampoulidis L, Vyrsokinos K, Stamatiadis C, Avramopoulos H, Zimmerman L, Voigt K, et al. The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards. In: Righini G, editor. Proceedings of SPIE, the International Society for Optical Engineering. Bellingham, WA, USA: SPIE, the International Society for Optical Engineering; 2010.
IEEE
[1]
L. Stampoulidis et al., “The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards,” in Proceedings of SPIE, the International Society for Optical Engineering, Brussels, Belgium, 2010, vol. 7719.
@inproceedings{1147169,
  abstract     = {The European BOOM project aims at the realization of high-capacity photonic routers using the silicon material as the base for functional and cost-effective integration. Here we present the design, fabrication and testing of the first BOOM-generation of hybrid integrated silicon photonic devices that implement key photonic routing functionalities. Ultra-fast all-optical wavelength converters and micro-ring resonator UDWDM label photodetectors are realized using either 4um SOI rib or SOI nanowire boards. For the realization of these devices, flip-chip compatible non-linear SOAs and evanescent PIN detectors have been designed and fabricated. These active components are integrated on the SOI boards using high precision flip-chip mounting and heterogeneous InP-to-silicon integration techniques. This type of scalable and cost-effective silicon-based component fabrication opens up the possibility for the realization of chip-scale, power efficient, Tb/s capacity photonic routers.},
  articleno    = {771909},
  author       = {Stampoulidis, Leontios and Vyrsokinos, Konstantinos and Stamatiadis, Christos and Avramopoulos, Hercules and Zimmerman, Lars and Voigt, Karsten and Sheng, Zhen and Van Thourhout, Dries and Kreissl, Jochen and Morl, Ludwig and Bolten, Jens and Wahlbrink, Thorsten and Gomez-Agis, Fausto and Tangdiongga, Eduward and Dorren, Harmen JS and Pagano, Annachiara and Riccardi, Emilio},
  booktitle    = {Proceedings of SPIE, the International Society for Optical Engineering},
  editor       = {Righini, GC},
  isbn         = {9780819481924},
  issn         = {0277-786X},
  keywords     = {silicon photonics,photonic routers,photonic integrated circuits,Silicon-on-insulator,hybrid integration,PHOTODETECTOR,all-optical wavelength converters},
  language     = {eng},
  location     = {Brussels, Belgium},
  pages        = {8},
  publisher    = {SPIE, the International Society for Optical Engineering},
  title        = {The BOOM project: a new generation of photonic routing subsystems using hybrid integration on silicon-on-insulator waveguide boards},
  url          = {http://dx.doi.org/10.1117/12.855958},
  volume       = {7719},
  year         = {2010},
}

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