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III-V/silicon-on-insulator nanophotonic cavities for optical network-on-chip

Liu Liu UGent, Günther Roelkens UGent, Joris Van Campenhout, Joost Brouckaert UGent, Dries Van Thourhout UGent and Roel Baets UGent (2010) JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY. 10(3). p.1461-1472
abstract
We review some opto-electronic devices based on the III-V/SOI heterogeneous integration platform, including lasers, modulators, wavelength converters, and photo-detectors. All of them are critical components for future on-chip interconnect and optical network-on-chip. The footprints of such devices are kept small by employing micro-cavity based structures. We give an overview of the device performances. The advantages over the all-silicon based devices are also discussed.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (review)
publication status
published
subject
keyword
Optical Interconnect, Heterogeneous Integration, SILICON EVANESCENT LASER, MACH-ZEHNDER MODULATOR, WAVE-GUIDE CIRCUIT, 1.5 MU-M, MICRODISK LASERS, ELECTROOPTIC MODULATOR, WAVELENGTH CONVERSION, MICRORING RESONATOR, COMPACT, DEVICES, Microdisk Laser, Silicon-on-Insulator, Silicon Photonics
journal title
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
J. Nanosci. Nanotechnol.
volume
10
issue
3
pages
1461 - 1472
Web of Science type
Review
Web of Science id
000273984800005
JCR category
MATERIALS SCIENCE, MULTIDISCIPLINARY
JCR impact factor
1.351 (2010)
JCR rank
94/219 (2010)
JCR quartile
2 (2010)
ISSN
1533-4880
DOI
10.1166/jnn.2010.2032
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1143587
handle
http://hdl.handle.net/1854/LU-1143587
date created
2011-02-09 13:18:52
date last changed
2016-12-19 15:45:27
@article{1143587,
  abstract     = {We review some opto-electronic devices based on the III-V/SOI heterogeneous integration platform, including lasers, modulators, wavelength converters, and photo-detectors. All of them are critical components for future on-chip interconnect and optical network-on-chip. The footprints of such devices are kept small by employing micro-cavity based structures. We give an overview of the device performances. The advantages over the all-silicon based devices are also discussed.},
  author       = {Liu, Liu and Roelkens, G{\"u}nther and Van Campenhout, Joris and Brouckaert, Joost and Van Thourhout, Dries and Baets, Roel},
  issn         = {1533-4880},
  journal      = {JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY},
  keyword      = {Optical Interconnect,Heterogeneous Integration,SILICON EVANESCENT LASER,MACH-ZEHNDER MODULATOR,WAVE-GUIDE CIRCUIT,1.5 MU-M,MICRODISK LASERS,ELECTROOPTIC MODULATOR,WAVELENGTH CONVERSION,MICRORING RESONATOR,COMPACT,DEVICES,Microdisk Laser,Silicon-on-Insulator,Silicon Photonics},
  language     = {eng},
  number       = {3},
  pages        = {1461--1472},
  title        = {III-V/silicon-on-insulator nanophotonic cavities for optical network-on-chip},
  url          = {http://dx.doi.org/10.1166/jnn.2010.2032},
  volume       = {10},
  year         = {2010},
}

Chicago
Liu, Liu, Günther Roelkens, Joris Van Campenhout, Joost Brouckaert, Dries Van Thourhout, and Roel Baets. 2010. “III-V/silicon-on-insulator Nanophotonic Cavities for Optical Network-on-chip.” Journal of Nanoscience and Nanotechnology 10 (3): 1461–1472.
APA
Liu, Liu, Roelkens, G., Van Campenhout, J., Brouckaert, J., Van Thourhout, D., & Baets, R. (2010). III-V/silicon-on-insulator nanophotonic cavities for optical network-on-chip. JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 10(3), 1461–1472.
Vancouver
1.
Liu L, Roelkens G, Van Campenhout J, Brouckaert J, Van Thourhout D, Baets R. III-V/silicon-on-insulator nanophotonic cavities for optical network-on-chip. JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY. 2010;10(3):1461–72.
MLA
Liu, Liu, Günther Roelkens, Joris Van Campenhout, et al. “III-V/silicon-on-insulator Nanophotonic Cavities for Optical Network-on-chip.” JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY 10.3 (2010): 1461–1472. Print.