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Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components

Maarten Cauwe UGent and Johan De Baets UGent (2010) IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 58(12). p.3842-3849
abstract
This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of an effective height that can be used to determine the resistance and inductance per unit length. The goal of the modeling is to predict the behavior of tracks running on top of or underneath components embedded in a printed circuit board. The proposed model is compared to quasi-static electromagnetic simulations. A dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (proceedingsPaper)
publication status
published
subject
keyword
ON-CHIP INTERCONNECTS, DESIGN OPTIMIZATION, BOARD, TRANSMISSION-LINE PARAMETERS, MODEL, PACKAGE, multilayer microstrip, embedded chip, Circuit model, LOSSY LINES, SUBSTRATE CAVITIES
journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
IEEE Trans. Microw. Theory Tech.
volume
58
issue
12
pages
3842 - 3849
conference name
IEEE International symposium on radio-frequency integration technology
conference location
Singapore, Singapore
conference start
2009-12-07
conference end
2009-12-11
Web of Science type
Proceedings Paper
Web of Science id
000285246500050
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
2.015 (2010)
JCR rank
42/247 (2010)
JCR quartile
1 (2010)
ISSN
0018-9480
DOI
10.1109/TMTT.2010.2086710
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1110866
handle
http://hdl.handle.net/1854/LU-1110866
date created
2011-01-27 14:47:13
date last changed
2016-12-19 15:43:53
@article{1110866,
  abstract     = {This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of an effective height that can be used to determine the resistance and inductance per unit length. The goal of the modeling is to predict the behavior of tracks running on top of or underneath components embedded in a printed circuit board. The proposed model is compared to quasi-static electromagnetic simulations. A dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model.},
  author       = {Cauwe, Maarten and De Baets, Johan},
  issn         = {0018-9480},
  journal      = {IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES},
  keyword      = {ON-CHIP INTERCONNECTS,DESIGN OPTIMIZATION,BOARD,TRANSMISSION-LINE PARAMETERS,MODEL,PACKAGE,multilayer microstrip,embedded chip,Circuit model,LOSSY LINES,SUBSTRATE CAVITIES},
  language     = {eng},
  location     = {Singapore, Singapore},
  number       = {12},
  pages        = {3842--3849},
  title        = {Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components},
  url          = {http://dx.doi.org/10.1109/TMTT.2010.2086710},
  volume       = {58},
  year         = {2010},
}

Chicago
Cauwe, Maarten, and Johan De Baets. 2010. “Propagation Behavior of Multilayer Microstrips Applied to Interconnects Running Near Embedded Integrated Components.” Ieee Transactions on Microwave Theory and Techniques 58 (12): 3842–3849.
APA
Cauwe, M., & De Baets, J. (2010). Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 58(12), 3842–3849. Presented at the IEEE International symposium on radio-frequency integration technology.
Vancouver
1.
Cauwe M, De Baets J. Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2010;58(12):3842–9.
MLA
Cauwe, Maarten, and Johan De Baets. “Propagation Behavior of Multilayer Microstrips Applied to Interconnects Running Near Embedded Integrated Components.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 58.12 (2010): 3842–3849. Print.