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Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components

Maarten Cauwe (UGent) and Johan De Baets (UGent)
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Abstract
This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of an effective height that can be used to determine the resistance and inductance per unit length. The goal of the modeling is to predict the behavior of tracks running on top of or underneath components embedded in a printed circuit board. The proposed model is compared to quasi-static electromagnetic simulations. A dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model.
Keywords
ON-CHIP INTERCONNECTS, DESIGN OPTIMIZATION, BOARD, TRANSMISSION-LINE PARAMETERS, MODEL, PACKAGE, multilayer microstrip, embedded chip, Circuit model, LOSSY LINES, SUBSTRATE CAVITIES

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Chicago
Cauwe, Maarten, and Johan De Baets. 2010. “Propagation Behavior of Multilayer Microstrips Applied to Interconnects Running Near Embedded Integrated Components.” Ieee Transactions on Microwave Theory and Techniques 58 (12): 3842–3849.
APA
Cauwe, M., & De Baets, J. (2010). Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 58(12), 3842–3849. Presented at the IEEE International symposium on radio-frequency integration technology.
Vancouver
1.
Cauwe M, De Baets J. Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2010;58(12):3842–9.
MLA
Cauwe, Maarten, and Johan De Baets. “Propagation Behavior of Multilayer Microstrips Applied to Interconnects Running Near Embedded Integrated Components.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 58.12 (2010): 3842–3849. Print.
@article{1110866,
  abstract     = {This paper presents a simple and accurate model for the multilayer microstrip, which can be easily implemented using closed-form microstrip design formulas. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The shunt impedance parameters per unit length are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of an effective height that can be used to determine the resistance and inductance per unit length. The goal of the modeling is to predict the behavior of tracks running on top of or underneath components embedded in a printed circuit board. The proposed model is compared to quasi-static electromagnetic simulations. A dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model.},
  author       = {Cauwe, Maarten and De Baets, Johan},
  issn         = {0018-9480},
  journal      = {IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES},
  keyword      = {ON-CHIP INTERCONNECTS,DESIGN OPTIMIZATION,BOARD,TRANSMISSION-LINE PARAMETERS,MODEL,PACKAGE,multilayer microstrip,embedded chip,Circuit model,LOSSY LINES,SUBSTRATE CAVITIES},
  language     = {eng},
  location     = {Singapore, Singapore},
  number       = {12},
  pages        = {3842--3849},
  title        = {Propagation behavior of multilayer microstrips applied to interconnects running near embedded integrated components},
  url          = {http://dx.doi.org/10.1109/TMTT.2010.2086710},
  volume       = {58},
  year         = {2010},
}

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