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Development of a thin-film stretchable electrical interconnection technology for biocompatible applications

Rik Verplancke UGent, Tom Sterken UGent, Fabrice Axisa UGent and Jan Vanfleteren UGent (2010) 2010 3rd electronic system-integration technology conference (ESTC 2010).
abstract
Stretchable electronics technologies have gained a lot of interest for reasons such as user comfort and reliability. Key aspect in these technologies is the fabrication of stretchable electrical interconnections. These are realized by patterning an intrinsic, non-stretchable gold film into a sequence of horseshoe shapes, acting as "2D" springs when embedded into PDMS. Polyimide is used as a supporting material, successfully enhancing reliability during mechanical loading. This was illustrated by application of various cyclic uni-axial strains to test structures which were fabricated in this technology. A lifetime over 130'000 and 500'000 cycles has been shown at strains of respectively 20% and 10%.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
keyword
flexible electronics, integrated circuit interconnections, circuit reliability, biomedical electronics, metallic thin films, polymer films
in
2010 3rd electronic system-integration technology conference (ESTC 2010)
pages
4 pages
publisher
IEEE
place of publication
Piscataway, NJ, USA
conference name
2010 3rd Electronic System-Integration Technology Conference (ESTC 2010)
conference location
Berlin, Germany
conference start
2010-09-13
conference end
2010-09-16
Web of Science type
Conference Paper
Web of Science id
11665182
ISBN
9781424485536
DOI
10.1109/ESTC.2010.5642910
language
English
UGent publication?
yes
classification
C1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1081523
handle
http://hdl.handle.net/1854/LU-1081523
date created
2010-12-02 10:35:08
date last changed
2011-04-06 16:18:08
@inproceedings{1081523,
  abstract     = {Stretchable electronics technologies have gained a lot of interest for reasons such as user comfort and reliability. Key aspect in these technologies is the fabrication of stretchable electrical interconnections. These are realized by patterning an intrinsic, non-stretchable gold film into a sequence of horseshoe shapes, acting as {\textacutedbl}2D{\textacutedbl} springs when embedded into PDMS. Polyimide is used as a supporting material, successfully enhancing reliability during mechanical loading. This was illustrated by application of various cyclic uni-axial strains to test structures which were fabricated in this technology. A lifetime over 130'000 and 500'000 cycles has been shown at strains of respectively 20\% and 10\%.},
  author       = {Verplancke, Rik and Sterken, Tom and Axisa, Fabrice and Vanfleteren, Jan},
  booktitle    = {2010 3rd electronic system-integration technology conference (ESTC 2010)},
  isbn         = {9781424485536},
  keyword      = {flexible electronics,integrated circuit interconnections,circuit reliability,biomedical electronics,metallic thin films,polymer films},
  language     = {eng},
  location     = {Berlin, Germany},
  pages        = {4},
  publisher    = {IEEE},
  title        = {Development of a thin-film stretchable electrical interconnection technology for biocompatible applications},
  url          = {http://dx.doi.org/10.1109/ESTC.2010.5642910},
  year         = {2010},
}

Chicago
Verplancke, Rik, Tom Sterken, Fabrice Axisa, and Jan Vanfleteren. 2010. “Development of a Thin-film Stretchable Electrical Interconnection Technology for Biocompatible Applications.” In 2010 3rd Electronic System-integration Technology Conference (ESTC 2010). Piscataway, NJ, USA: IEEE.
APA
Verplancke, R., Sterken, T., Axisa, F., & Vanfleteren, J. (2010). Development of a thin-film stretchable electrical interconnection technology for biocompatible applications. 2010 3rd electronic system-integration technology conference (ESTC 2010). Presented at the 2010 3rd Electronic System-Integration Technology Conference (ESTC 2010), Piscataway, NJ, USA: IEEE.
Vancouver
1.
Verplancke R, Sterken T, Axisa F, Vanfleteren J. Development of a thin-film stretchable electrical interconnection technology for biocompatible applications. 2010 3rd electronic system-integration technology conference (ESTC 2010). Piscataway, NJ, USA: IEEE; 2010.
MLA
Verplancke, Rik, Tom Sterken, Fabrice Axisa, et al. “Development of a Thin-film Stretchable Electrical Interconnection Technology for Biocompatible Applications.” 2010 3rd Electronic System-integration Technology Conference (ESTC 2010). Piscataway, NJ, USA: IEEE, 2010. Print.