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Reliability assessment of stretchable interconnects

Yung Yu Hsu, B Dimcic, Mario Gonzalez, Frederick Bossuyt UGent, Jan Vanfleteren UGent and Ingrid De Wolf (2010) Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts.
Please use this url to cite or link to this publication:
author
organization
year
type
conference
publication status
published
subject
in
Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts
conference name
5th International Microsystems, Packaging, Assembly and Circuits technology conference (IMPACT 2010)
conference location
Taipei, Taiwan
conference start
2010-10-20
conference end
2010-10-22
language
English
UGent publication?
yes
classification
C3
id
1071485
handle
http://hdl.handle.net/1854/LU-1071485
date created
2010-11-08 11:20:05
date last changed
2016-12-19 15:35:46
@inproceedings{1071485,
  author       = {Hsu, Yung Yu and Dimcic, B and Gonzalez, Mario and Bossuyt, Frederick and Vanfleteren, Jan and De Wolf, Ingrid},
  booktitle    = {Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts},
  language     = {eng},
  location     = {Taipei, Taiwan},
  title        = {Reliability assessment of stretchable interconnects},
  year         = {2010},
}

Chicago
Hsu, Yung Yu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren, and Ingrid De Wolf. 2010. “Reliability Assessment of Stretchable Interconnects.” In Microsystems, Packaging, Assembly and Circuits Technology Conference, 5th International, Abstracts.
APA
Hsu, Y. Y., Dimcic, B., Gonzalez, M., Bossuyt, F., Vanfleteren, J., & De Wolf, I. (2010). Reliability assessment of stretchable interconnects. Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts. Presented at the 5th International Microsystems, Packaging, Assembly and Circuits technology conference (IMPACT 2010).
Vancouver
1.
Hsu YY, Dimcic B, Gonzalez M, Bossuyt F, Vanfleteren J, De Wolf I. Reliability assessment of stretchable interconnects. Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts. 2010.
MLA
Hsu, Yung Yu, B Dimcic, Mario Gonzalez, et al. “Reliability Assessment of Stretchable Interconnects.” Microsystems, Packaging, Assembly and Circuits Technology Conference, 5th International, Abstracts. 2010. Print.