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Chicago
Hsu, Yung Yu, B Dimcic, Mario Gonzalez, Frederick Bossuyt, Jan Vanfleteren, and Ingrid De Wolf. 2010. “Reliability Assessment of Stretchable Interconnects.” In Microsystems, Packaging, Assembly and Circuits Technology Conference, 5th International, Abstracts.
APA
Hsu, Y. Y., Dimcic, B., Gonzalez, M., Bossuyt, F., Vanfleteren, J., & De Wolf, I. (2010). Reliability assessment of stretchable interconnects. Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts. Presented at the 5th International Microsystems, Packaging, Assembly and Circuits technology conference (IMPACT 2010).
Vancouver
1.
Hsu YY, Dimcic B, Gonzalez M, Bossuyt F, Vanfleteren J, De Wolf I. Reliability assessment of stretchable interconnects. Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts. 2010.
MLA
Hsu, Yung Yu, B Dimcic, Mario Gonzalez, et al. “Reliability Assessment of Stretchable Interconnects.” Microsystems, Packaging, Assembly and Circuits Technology Conference, 5th International, Abstracts. 2010. Print.
@inproceedings{1071485,
  author       = {Hsu, Yung Yu and Dimcic, B and Gonzalez, Mario and Bossuyt, Frederick and Vanfleteren, Jan and De Wolf, Ingrid},
  booktitle    = {Microsystems, Packaging, Assembly and Circuits technology conference, 5th International, Abstracts},
  language     = {eng},
  location     = {Taipei, Taiwan},
  title        = {Reliability assessment of stretchable interconnects},
  year         = {2010},
}