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Design and analysis of a novel fine pitch and highly stretchable interconnect

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt UGent, Fabrice Axisa UGent, Jan Vanfleteren UGent, Bart Vandevelde and Ingrid De Wolf (2010) MICROELECTRONICS INTERNATIONAL. 27(1). p.33-38
abstract
Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for "fine pitch" applications in stretchable electronics. Design/methodology/approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home-built electromechanical measurement is carried out by the four-probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading. Findings - The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling, and strain localized at the crest of a zigzag structure. Originality/value - In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
Material-deforming processes, Deformation, Bonding, Films (states of matter), Elastomers, ELECTRONIC-CIRCUITS, POLYMER SUBSTRATE, METAL-FILM
journal title
MICROELECTRONICS INTERNATIONAL
Microelectron. Int.
volume
27
issue
1
pages
33 - 38
Web of Science type
Article
Web of Science id
000274510300006
JCR category
ENGINEERING, ELECTRICAL & ELECTRONIC
JCR impact factor
0.468 (2010)
JCR rank
190/247 (2010)
JCR quartile
4 (2010)
ISSN
1356-5362
DOI
10.1108/13565361011009504
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1071460
handle
http://hdl.handle.net/1854/LU-1071460
date created
2010-11-08 10:56:32
date last changed
2010-11-09 09:44:56
@article{1071460,
  abstract     = {Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for {\textacutedbl}fine pitch{\textacutedbl} applications in stretchable electronics.
Design/methodology/approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home-built electromechanical measurement is carried out by the four-probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading.
Findings - The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling, and strain localized at the crest of a zigzag structure.
Originality/value - In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.},
  author       = {Hsu, Yung Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and Vandevelde, Bart and De Wolf, Ingrid},
  issn         = {1356-5362},
  journal      = {MICROELECTRONICS INTERNATIONAL},
  keyword      = {Material-deforming processes,Deformation,Bonding,Films (states of matter),Elastomers,ELECTRONIC-CIRCUITS,POLYMER SUBSTRATE,METAL-FILM},
  language     = {eng},
  number       = {1},
  pages        = {33--38},
  title        = {Design and analysis of a novel fine pitch and highly stretchable interconnect},
  url          = {http://dx.doi.org/10.1108/13565361011009504},
  volume       = {27},
  year         = {2010},
}

Chicago
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde, and Ingrid De Wolf. 2010. “Design and Analysis of a Novel Fine Pitch and Highly Stretchable Interconnect.” Microelectronics International 27 (1): 33–38.
APA
Hsu, Y. Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., Vandevelde, B., & De Wolf, I. (2010). Design and analysis of a novel fine pitch and highly stretchable interconnect. MICROELECTRONICS INTERNATIONAL, 27(1), 33–38.
Vancouver
1.
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, Vandevelde B, et al. Design and analysis of a novel fine pitch and highly stretchable interconnect. MICROELECTRONICS INTERNATIONAL. 2010;27(1):33–8.
MLA
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, et al. “Design and Analysis of a Novel Fine Pitch and Highly Stretchable Interconnect.” MICROELECTRONICS INTERNATIONAL 27.1 (2010): 33–38. Print.