Advanced search
1 file | 995.53 KB

Design and analysis of a novel fine pitch and highly stretchable interconnect

Author
Organization
Abstract
Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for "fine pitch" applications in stretchable electronics. Design/methodology/approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home-built electromechanical measurement is carried out by the four-probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading. Findings - The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling, and strain localized at the crest of a zigzag structure. Originality/value - In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.
Keywords
Material-deforming processes, Deformation, Bonding, Films (states of matter), Elastomers, ELECTRONIC-CIRCUITS, POLYMER SUBSTRATE, METAL-FILM

Downloads

  • (...).pdf
    • full text
    • |
    • UGent only
    • |
    • PDF
    • |
    • 995.53 KB

Citation

Please use this url to cite or link to this publication:

Chicago
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Bart Vandevelde, and Ingrid De Wolf. 2010. “Design and Analysis of a Novel Fine Pitch and Highly Stretchable Interconnect.” Microelectronics International 27 (1): 33–38.
APA
Hsu, Y. Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., Vandevelde, B., & De Wolf, I. (2010). Design and analysis of a novel fine pitch and highly stretchable interconnect. MICROELECTRONICS INTERNATIONAL, 27(1), 33–38.
Vancouver
1.
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, Vandevelde B, et al. Design and analysis of a novel fine pitch and highly stretchable interconnect. MICROELECTRONICS INTERNATIONAL. 2010;27(1):33–8.
MLA
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, et al. “Design and Analysis of a Novel Fine Pitch and Highly Stretchable Interconnect.” MICROELECTRONICS INTERNATIONAL 27.1 (2010): 33–38. Print.
@article{1071460,
  abstract     = {Purpose - The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for {\textacutedbl}fine pitch{\textacutedbl} applications in stretchable electronics.
Design/methodology/approach - A patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. In situ home-built electromechanical measurement is carried out by the four-probe technique. Finite element method is used to analyze the deformation behavior of a zigzag shape interconnect under uniaxial tensile loading.
Findings - The electrical resistance remains constant until metal breakdown at elongations beyond 40 percent. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling, and strain localized at the crest of a zigzag structure.
Originality/value - In this paper, the zigzag shape is, for the first time, proven as a promising design for stretchable interconnects, especially for fine pitch applications.},
  author       = {Hsu, Yung Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and Vandevelde, Bart and De Wolf, Ingrid},
  issn         = {1356-5362},
  journal      = {MICROELECTRONICS INTERNATIONAL},
  keyword      = {Material-deforming processes,Deformation,Bonding,Films (states of matter),Elastomers,ELECTRONIC-CIRCUITS,POLYMER SUBSTRATE,METAL-FILM},
  language     = {eng},
  number       = {1},
  pages        = {33--38},
  title        = {Design and analysis of a novel fine pitch and highly stretchable interconnect},
  url          = {http://dx.doi.org/10.1108/13565361011009504},
  volume       = {27},
  year         = {2010},
}

Altmetric
View in Altmetric
Web of Science
Times cited: