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The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

Yung Yu Hsu, Mario Gonzalez, Frederick Bossuyt UGent, Fabrice Axisa UGent, Jan Vanfleteren UGent and Ingrid De Wolf (2010) JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 20(7).
abstract
The deformation behavior and failure mechanisms of parallel-aligned, horseshoe-patterned, stretchable conductors encapsulated in a polymer substrate were investigated by numerical and experimental analyses. A design guideline for the optimal pitch between the conductors was proposed through numerical analysis, and two extreme cases-fine and coarse pitches-were investigated by in situ experimental observations. The experimental results demonstrate that the stretchable conductors enable elongation up to 123 and 135% without metal rupture for the fine and coarse pitches, respectively. The difference between these numbers is much smaller (12%) than expected from the simulations. It is found and confirmed by a modified simulation model that the reason for this is interfacial delamination, the onset of which depends on the pitch of the conductors and occurs before metal rupture of the conductors. The definition of 'stretchability of the electronic interconnects' is discussed based on the facts that two different failure mechanisms occur: interfacial delamination and metal rupture.
Please use this url to cite or link to this publication:
author
organization
year
type
journalArticle (original)
publication status
published
subject
keyword
METAL-FILMS, ELECTRONIC-CIRCUITS, DESIGN, INTERCONNECTS, FABRICATION, ELASTOMER
journal title
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
J. Micromech. Microeng.
volume
20
issue
7
article_number
075036
pages
11 pages
Web of Science type
Article
Web of Science id
000279260400036
JCR category
MECHANICS
JCR impact factor
2.276 (2010)
JCR rank
12/132 (2010)
JCR quartile
1 (2010)
ISSN
0960-1317
DOI
10.1088/0960-1317/20/7/075036
language
English
UGent publication?
yes
classification
A1
copyright statement
I have transferred the copyright for this publication to the publisher
id
1071448
handle
http://hdl.handle.net/1854/LU-1071448
date created
2010-11-08 10:52:41
date last changed
2010-11-09 12:09:26
@article{1071448,
  abstract     = {The deformation behavior and failure mechanisms of parallel-aligned, horseshoe-patterned, stretchable conductors encapsulated in a polymer substrate were investigated by numerical and experimental analyses. A design guideline for the optimal pitch between the conductors was proposed through numerical analysis, and two extreme cases-fine and coarse pitches-were investigated by in situ experimental observations. The experimental results demonstrate that the stretchable conductors enable elongation up to 123 and 135\% without metal rupture for the fine and coarse pitches, respectively. The difference between these numbers is much smaller (12\%) than expected from the simulations. It is found and confirmed by a modified simulation model that the reason for this is interfacial delamination, the onset of which depends on the pitch of the conductors and occurs before metal rupture of the conductors. The definition of 'stretchability of the electronic interconnects' is discussed based on the facts that two different failure mechanisms occur: interfacial delamination and metal rupture.},
  articleno    = {075036},
  author       = {Hsu, Yung Yu and Gonzalez, Mario and Bossuyt, Frederick and Axisa, Fabrice and Vanfleteren, Jan and De Wolf, Ingrid},
  issn         = {0960-1317},
  journal      = {JOURNAL OF MICROMECHANICS AND MICROENGINEERING},
  keyword      = {METAL-FILMS,ELECTRONIC-CIRCUITS,DESIGN,INTERCONNECTS,FABRICATION,ELASTOMER},
  language     = {eng},
  number       = {7},
  pages        = {11},
  title        = {The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit},
  url          = {http://dx.doi.org/10.1088/0960-1317/20/7/075036},
  volume       = {20},
  year         = {2010},
}

Chicago
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, and Ingrid De Wolf. 2010. “The Effect of Pitch on Deformation Behavior and the Stretching-induced Failure of a Polymer-encapsulated Stretchable Circuit.” Journal of Micromechanics and Microengineering 20 (7).
APA
Hsu, Y. Y., Gonzalez, M., Bossuyt, F., Axisa, F., Vanfleteren, J., & De Wolf, I. (2010). The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit. JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 20(7).
Vancouver
1.
Hsu YY, Gonzalez M, Bossuyt F, Axisa F, Vanfleteren J, De Wolf I. The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit. JOURNAL OF MICROMECHANICS AND MICROENGINEERING. 2010;20(7).
MLA
Hsu, Yung Yu, Mario Gonzalez, Frederick Bossuyt, et al. “The Effect of Pitch on Deformation Behavior and the Stretching-induced Failure of a Polymer-encapsulated Stretchable Circuit.” JOURNAL OF MICROMECHANICS AND MICROENGINEERING 20.7 (2010): n. pag. Print.