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High-frequency characterization of embedded components in printed circuit boards

Maarten Cauwe (UGent)
(2010)
Author
Promoter
(UGent)
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Abstract
The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance.
Keywords
Chip embedding, High-Frequency

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Citation

Please use this url to cite or link to this publication:

Chicago
Cauwe, Maarten. 2010. “High-frequency Characterization of Embedded Components in Printed Circuit Boards”. Ghent, Belgium: Ghent University. Faculty of Engineering.
APA
Cauwe, M. (2010). High-frequency characterization of embedded components in printed circuit boards. Ghent University. Faculty of Engineering, Ghent, Belgium.
Vancouver
1.
Cauwe M. High-frequency characterization of embedded components in printed circuit boards. [Ghent, Belgium]: Ghent University. Faculty of Engineering; 2010.
MLA
Cauwe, Maarten. “High-frequency Characterization of Embedded Components in Printed Circuit Boards.” 2010 : n. pag. Print.
@phdthesis{1041792,
  abstract     = {The embedding of electronic components is a three-dimensional packaging technology, where chips are placed inside of the printed circuit board instead of on top. The advantage of this technology is the reduced electronic interconnection length between components. The shorter this connection, the faster the signal transmission can occur. Different high-frequency aspects of chip embedding are investigated within this dissertation: interconnections to the embedded chip, crosstalk between signals on the chip and on the board, and interconnections running on top of or underneath embedded components. The high-frequency behavior of tracks running near embedded components is described using a broadband model for multilayer microstrip transmission lines. The proposed model can be used to predict the characteristic impedance and the loss of the lines. The model is based on two similar approximations that reduce the multilayer substrate to an equivalent single-layer structure. The per-unit-length shunt impedance parameters are derived from the complex effective dielectric constant, which is obtained using a variational method. A complex image approach results in the calculation of a frequency-dependent effective height that can be used to determine the per-unit-length resistance and inductance. A deliberate choice was made for a simple but accurate model that could easily be implemented in current high-frequency circuit simulators. Next to quasi-static electromagnetic simulations, a dedicated test vehicle that allows for the direct extraction of the propagation constant of these multilayer microstrips is manufactured and used to verify the model. The verification of the model using simulation and measurements shows that the proposed model slightly overestimates the loss of the measured multilayer microstrips, but is more accurate than the simulations in predicting the characteristic impedance.},
  author       = {Cauwe, Maarten},
  isbn         = {9789085783633},
  keyword      = {Chip embedding,High-Frequency},
  language     = {eng},
  pages        = {XXXII, 226},
  publisher    = {Ghent University. Faculty of Engineering},
  school       = {Ghent University},
  title        = {High-frequency characterization of embedded components in printed circuit boards},
  url          = {http://lib.ugent.be/fulltxt/RUG01/001/402/659/RUG01-001402659\_2010\_0001\_AC.pdf},
  year         = {2010},
}