Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures
- Author
- Tim Pattyn (UGent) , Xiao Sun, Eric Beyne, Daniël De Zutter (UGent) , Martijn Huynen (UGent) and Dries Vande Ginste (UGent)
- Organization
- Project
- Abstract
- In this contribution, an enhanced 3-D differential surface admittance operator is proposed, facilitating accurate modeling of piecewise homogeneous cuboidal objects. By exploiting the analytical properties of entire-domain basis functions, material interfaces are effectively eliminated from the formulation, leading to a reduction in the number of unknowns without compromising the accuracy of the operator. After a validation of the novel approach, its effectiveness is demonstrated through the analysis of the impedance responses of on-chip interdigital capacitor structures. Index Terms-3-D differential surface admittance (DSA) operator, single-source boundary integral equation (BIE), piecewise homogeneous media, material interfaces, on-chip capacitor
Downloads
-
8975 acc.pdf
- full text (Accepted manuscript)
- |
- open access
- |
- |
- 211.36 KB
-
(...).pdf
- full text (Published version)
- |
- UGent only
- |
- |
- 249.76 KB
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01KGEW9SSP43ZCCTGCB9ZFY7H0
- MLA
- Pattyn, Tim, et al. “Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors Using a 3-D DSA Operator for Piecewise Homogeneous Structures.” 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2025, pp. 1–3, doi:10.1109/epeps63858.2025.11346718.
- APA
- Pattyn, T., Sun, X., Beyne, E., De Zutter, D., Huynen, M., & Vande Ginste, D. (2025). Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures. 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1–3. https://doi.org/10.1109/epeps63858.2025.11346718
- Chicago author-date
- Pattyn, Tim, Xiao Sun, Eric Beyne, Daniël De Zutter, Martijn Huynen, and Dries Vande Ginste. 2025. “Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors Using a 3-D DSA Operator for Piecewise Homogeneous Structures.” In 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1–3. IEEE. https://doi.org/10.1109/epeps63858.2025.11346718.
- Chicago author-date (all authors)
- Pattyn, Tim, Xiao Sun, Eric Beyne, Daniël De Zutter, Martijn Huynen, and Dries Vande Ginste. 2025. “Broadband Impedance Response Extraction of On-Chip Interdigital Capacitors Using a 3-D DSA Operator for Piecewise Homogeneous Structures.” In 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 1–3. IEEE. doi:10.1109/epeps63858.2025.11346718.
- Vancouver
- 1.Pattyn T, Sun X, Beyne E, De Zutter D, Huynen M, Vande Ginste D. Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures. In: 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS). IEEE; 2025. p. 1–3.
- IEEE
- [1]T. Pattyn, X. Sun, E. Beyne, D. De Zutter, M. Huynen, and D. Vande Ginste, “Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures,” in 2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Milpitas, USA, 2025, pp. 1–3.
@inproceedings{01KGEW9SSP43ZCCTGCB9ZFY7H0,
abstract = {{In this contribution, an enhanced 3-D differential surface admittance operator is proposed, facilitating accurate modeling of piecewise homogeneous cuboidal objects. By exploiting the analytical properties of entire-domain basis functions, material interfaces are effectively eliminated from the formulation, leading to a reduction in the number of unknowns without compromising the accuracy of the operator. After a validation of the novel approach, its effectiveness is demonstrated through the analysis of the impedance responses of on-chip interdigital capacitor structures. Index Terms-3-D differential surface admittance (DSA) operator, single-source boundary integral equation (BIE), piecewise homogeneous media, material interfaces, on-chip capacitor}},
author = {{Pattyn, Tim and Sun, Xiao and Beyne, Eric and De Zutter, Daniël and Huynen, Martijn and Vande Ginste, Dries}},
booktitle = {{2025 IEEE 34th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)}},
isbn = {{9798331585143}},
issn = {{2165-4115}},
language = {{eng}},
location = {{Milpitas, USA}},
pages = {{1--3}},
publisher = {{IEEE}},
title = {{Broadband impedance response extraction of on-chip interdigital capacitors using a 3-D DSA operator for piecewise homogeneous structures}},
url = {{http://doi.org/10.1109/epeps63858.2025.11346718}},
year = {{2025}},
}
- Altmetric
- View in Altmetric