Polylactic acid and polyhydroxybutyrate as printed circuit board substrates : a novel approach
- Author
- Zahra Fazlali (UGent) , David Schaubroeck (UGent) , Maarten Cauwe (UGent) , Ludwig Cardon (UGent) , Pieter Bauwens (UGent) and Jan Vanfleteren (UGent)
- Organization
- Abstract
- This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads to a reduction in negative impacts. Polylactic acid (PLA) and Polyhydroxybutyrate (PHB) biopolymers are used in this study. These two biopolymers have low melting points (130-180 degrees C, and 170-180 degrees C, respectively) and cannot withstand the high temperature soldering process (up to 260 degrees C for standard SAC (SnAgCu, tin/silver/copper) lead free solder processes). Our approach for replacing the PCB substrate is applying the PLA/PHB carrier substrate at the end of the PCB manufacturing process using injection molding technology. This approach involves all the standard PCB processes, including wet etching of the Cu conductors, and component assembly with SAC solder on a thin flexible polyimide (PI) foil with patterned Cu conductors and then overmolding the biopolymer onto the foil to create a rigid base. This study demonstrates the functionality of two test circuits fabricated using this method. In addition, we evaluated the adhesion between the biopolymer and PI to achieve a durable PCB. Moreover, we performed two different end-of-life approaches (debonding and composting) as a part of the end-of-life consideration. By incorporating biodegradable materials into PCB standard manufacturing, the CO2 emissions and energy consumption are significantly reduced, and installation costs are lowered.
- Keywords
- COMPOSITES, ELECTRONICS, DEGRADATION, green electronics, printed circuit board, biodegradable materials, sustainability
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01K4282X5K6VGSM35Q9EZGY60D
- MLA
- Fazlali, Zahra, et al. “Polylactic Acid and Polyhydroxybutyrate as Printed Circuit Board Substrates : A Novel Approach.” PROCESSES, vol. 13, no. 5, 2025, doi:10.3390/pr13051360.
- APA
- Fazlali, Z., Schaubroeck, D., Cauwe, M., Cardon, L., Bauwens, P., & Vanfleteren, J. (2025). Polylactic acid and polyhydroxybutyrate as printed circuit board substrates : a novel approach. PROCESSES, 13(5). https://doi.org/10.3390/pr13051360
- Chicago author-date
- Fazlali, Zahra, David Schaubroeck, Maarten Cauwe, Ludwig Cardon, Pieter Bauwens, and Jan Vanfleteren. 2025. “Polylactic Acid and Polyhydroxybutyrate as Printed Circuit Board Substrates : A Novel Approach.” PROCESSES 13 (5). https://doi.org/10.3390/pr13051360.
- Chicago author-date (all authors)
- Fazlali, Zahra, David Schaubroeck, Maarten Cauwe, Ludwig Cardon, Pieter Bauwens, and Jan Vanfleteren. 2025. “Polylactic Acid and Polyhydroxybutyrate as Printed Circuit Board Substrates : A Novel Approach.” PROCESSES 13 (5). doi:10.3390/pr13051360.
- Vancouver
- 1.Fazlali Z, Schaubroeck D, Cauwe M, Cardon L, Bauwens P, Vanfleteren J. Polylactic acid and polyhydroxybutyrate as printed circuit board substrates : a novel approach. PROCESSES. 2025;13(5).
- IEEE
- [1]Z. Fazlali, D. Schaubroeck, M. Cauwe, L. Cardon, P. Bauwens, and J. Vanfleteren, “Polylactic acid and polyhydroxybutyrate as printed circuit board substrates : a novel approach,” PROCESSES, vol. 13, no. 5, 2025.
@article{01K4282X5K6VGSM35Q9EZGY60D,
abstract = {{This study presents a novel approach to manufacture a rigid printed circuit board (PCB) using sustainable polymers. Current PCBs use a fossil-fuel-based substrate, like FR4. This presents recycling challenges due to its composite nature. Replacing the substrate with an environmentally friendly alternative leads to a reduction in negative impacts. Polylactic acid (PLA) and Polyhydroxybutyrate (PHB) biopolymers are used in this study. These two biopolymers have low melting points (130-180 degrees C, and 170-180 degrees C, respectively) and cannot withstand the high temperature soldering process (up to 260 degrees C for standard SAC (SnAgCu, tin/silver/copper) lead free solder processes). Our approach for replacing the PCB substrate is applying the PLA/PHB carrier substrate at the end of the PCB manufacturing process using injection molding technology. This approach involves all the standard PCB processes, including wet etching of the Cu conductors, and component assembly with SAC solder on a thin flexible polyimide (PI) foil with patterned Cu conductors and then overmolding the biopolymer onto the foil to create a rigid base. This study demonstrates the functionality of two test circuits fabricated using this method. In addition, we evaluated the adhesion between the biopolymer and PI to achieve a durable PCB. Moreover, we performed two different end-of-life approaches (debonding and composting) as a part of the end-of-life consideration. By incorporating biodegradable materials into PCB standard manufacturing, the CO2 emissions and energy consumption are significantly reduced, and installation costs are lowered.}},
articleno = {{1360}},
author = {{Fazlali, Zahra and Schaubroeck, David and Cauwe, Maarten and Cardon, Ludwig and Bauwens, Pieter and Vanfleteren, Jan}},
issn = {{2227-9717}},
journal = {{PROCESSES}},
keywords = {{COMPOSITES,ELECTRONICS,DEGRADATION,green electronics,printed circuit board,biodegradable materials,sustainability}},
language = {{eng}},
number = {{5}},
pages = {{19}},
title = {{Polylactic acid and polyhydroxybutyrate as printed circuit board substrates : a novel approach}},
url = {{http://doi.org/10.3390/pr13051360}},
volume = {{13}},
year = {{2025}},
}
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