Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics
- Author
- Jef Van Asch (UGent) , Jeroen Missinne (UGent) , Junwen He, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout and Geert Van Steenberge (UGent)
- Organization
- Abstract
- Co-packaged optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. We present two heterogeneous integration techniques that enable high-density optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides. In the first approach, polymer waveguides are patterned using standard lithography directly on the surface of the photonic chip, ensuring compatibility with chip embedding as commonly employed in chip-first fanout wafer-level packaging. In the second approach, photonic chips are flip-chip bonded to the package substrate. Both techniques have been experimentally validated, achieving a coupling efficiency near 1 dB between SiN and polymer waveguides in the O-band, for both TE and TM polarizations. SiN tapers were designed using the “Mono” method to optimize phase-matching conditions between the two waveguides, a critical requirement for integrating diverse optical components. These results demonstrate the potential of polymer waveguides in co-packaged optics applications, achieving sub-2 dB chip-to-chip and chip-to-fiber coupling losses.
- Keywords
- Photonic Integrated circuits, Co-Packaged Optics, Optical Redistribution Layer, Polymer waveguides, Adiabatic coupling, Heterogeneous integration
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01JWZXTFZYH1TQ1TZQV2C2YW4Q
- MLA
- Van Asch, Jef, et al. “Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics.” OPTICA, vol. 12, no. 6, 2025, pp. 821–30, doi:10.1364/optica.559260.
- APA
- Van Asch, J., Missinne, J., He, J., Podpod, A., Lepage, G., Golshani, N., … Van Steenberge, G. (2025). Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics. OPTICA, 12(6), 821–830. https://doi.org/10.1364/optica.559260
- Chicago author-date
- Van Asch, Jef, Jeroen Missinne, Junwen He, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, et al. 2025. “Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics.” OPTICA 12 (6): 821–30. https://doi.org/10.1364/optica.559260.
- Chicago author-date (all authors)
- Van Asch, Jef, Jeroen Missinne, Junwen He, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout, and Geert Van Steenberge. 2025. “Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics.” OPTICA 12 (6): 821–830. doi:10.1364/optica.559260.
- Vancouver
- 1.Van Asch J, Missinne J, He J, Podpod A, Lepage G, Golshani N, et al. Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics. OPTICA. 2025;12(6):821–30.
- IEEE
- [1]J. Van Asch et al., “Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics,” OPTICA, vol. 12, no. 6, pp. 821–830, 2025.
@article{01JWZXTFZYH1TQ1TZQV2C2YW4Q,
abstract = {{Co-packaged optics applications require scalable and high-yield optical interfacing solutions to silicon photonic chiplets, offering low-loss, broadband, and polarization-independent optical coupling while maintaining compatibility with widely used approaches for electrical redistribution. We present two heterogeneous integration techniques that enable high-density optical I/O connections, utilizing adiabatic coupling between on-chip silicon nitride (SiN) waveguides and package-level polymer optical waveguides. In the first approach, polymer waveguides are patterned using standard lithography directly on the surface of the photonic chip, ensuring compatibility with chip embedding as commonly employed in chip-first fanout wafer-level packaging. In the second approach, photonic chips are flip-chip bonded to the package substrate. Both techniques have been experimentally validated, achieving a coupling efficiency near 1 dB between SiN and polymer waveguides in the O-band, for both TE and TM polarizations. SiN tapers were designed using the “Mono” method to optimize phase-matching conditions between the two waveguides, a critical requirement for integrating diverse optical components. These results demonstrate the potential of polymer waveguides in co-packaged optics applications, achieving sub-2 dB chip-to-chip and chip-to-fiber coupling losses.}},
author = {{Van Asch, Jef and Missinne, Jeroen and He, Junwen and Podpod, Arnita and Lepage, Guy and Golshani, Negin and Magdziak, Rafal and Sar, Huseyin and Kobbi, Hakim and Bipul, Swetanshu and Bode, Dieter and Ban, Yoojin and Ferraro, Filippo and Van Campenhout, Joris and Van Steenberge, Geert}},
issn = {{2334-2536}},
journal = {{OPTICA}},
keywords = {{Photonic Integrated circuits,Co-Packaged Optics,Optical Redistribution Layer,Polymer waveguides,Adiabatic coupling,Heterogeneous integration}},
language = {{eng}},
number = {{6}},
pages = {{821--830}},
title = {{Low-loss integration of high-density polymer waveguides with silicon photonics for co-packaged optics}},
url = {{http://doi.org/10.1364/optica.559260}},
volume = {{12}},
year = {{2025}},
}
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