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Special section guest editorial : packaging challenges of photonic integrated circuits

Jeroen Missinne (UGent) , Yanlu Li (UGent) , Stefan Mohrdiek and Padraic Morrissey
(2024) JOURNAL OF OPTICAL MICROSYSTEMS. 4(1).
Author
Organization
Keywords
Photonic Integrated Circuits, packaging, integration, challenges

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Citation

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MLA
Missinne, Jeroen, et al. “Special Section Guest Editorial : Packaging Challenges of Photonic Integrated Circuits.” JOURNAL OF OPTICAL MICROSYSTEMS, vol. 4, no. 1, 2024, doi:10.1117/1.jom.4.1.011001.
APA
Missinne, J., Li, Y., Mohrdiek, S., & Morrissey, P. (2024). Special section guest editorial : packaging challenges of photonic integrated circuits. https://doi.org/10.1117/1.jom.4.1.011001
Chicago author-date
Missinne, Jeroen, Yanlu Li, Stefan Mohrdiek, and Padraic Morrissey. 2024. “Special Section Guest Editorial : Packaging Challenges of Photonic Integrated Circuits.” JOURNAL OF OPTICAL MICROSYSTEMS. https://doi.org/10.1117/1.jom.4.1.011001.
Chicago author-date (all authors)
Missinne, Jeroen, Yanlu Li, Stefan Mohrdiek, and Padraic Morrissey. 2024. “Special Section Guest Editorial : Packaging Challenges of Photonic Integrated Circuits.” JOURNAL OF OPTICAL MICROSYSTEMS. doi:10.1117/1.jom.4.1.011001.
Vancouver
1.
Missinne J, Li Y, Mohrdiek S, Morrissey P. Special section guest editorial : packaging challenges of photonic integrated circuits. Vol. 4, JOURNAL OF OPTICAL MICROSYSTEMS. 2024.
IEEE
[1]
J. Missinne, Y. Li, S. Mohrdiek, and P. Morrissey, “Special section guest editorial : packaging challenges of photonic integrated circuits,” JOURNAL OF OPTICAL MICROSYSTEMS, vol. 4, no. 1. 2024.
@misc{01HWMW7JXTXMXCFDDHTR2QVKWA,
  articleno    = {{011001}},
  author       = {{Missinne, Jeroen and Li, Yanlu and Mohrdiek, Stefan and Morrissey, Padraic}},
  issn         = {{2708-5260}},
  keywords     = {{Photonic Integrated Circuits,packaging,integration,challenges}},
  language     = {{eng}},
  number       = {{1}},
  pages        = {{2}},
  series       = {{JOURNAL OF OPTICAL MICROSYSTEMS}},
  title        = {{Special section guest editorial : packaging challenges of photonic integrated circuits}},
  url          = {{http://doi.org/10.1117/1.jom.4.1.011001}},
  volume       = {{4}},
  year         = {{2024}},
}
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