Heterogenous Photonic Integration for Quantum Optical Communication
- Author
- Janez Krc, Andraz Debevc, Milos Ljubotina, Marko Topic, Isaac Luntadila Lufungula (UGent) , Jasper De Witte (UGent) , Leonardo Midolo, Claus Pedersen, Amir Hossein Ghadimi, Hamed Sattari, Michel Despont, Simone Ferrari, Wolfram Pernice and Dries Van Thourhout (UGent)
- Organization
- Abstract
- Photonic integrated circuits (PICs) play an important role in telecom and datacom applications. While in the past integrated transceivers were the main driver for technological advances in integrated photonics, nowadays PICs are emerging in various other fields, such as sensing, high-performance computing, quantum technologies, and more [1]. Various material platforms for PICs have been developed and successfully utilized, like III-V semiconductors (InP, GaAs), silicon-based materials (Si, Si 3 N 4 , SiO 2 ), lithium niobate (LiNbO 3 ), polymers and others.
- Keywords
- Photonic integrated circuit, Heterogeneous integration, Micro-transfer printing, Quantum technologies, Optical communication, Device-independent quantum key distribution
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01HPEE9696RTFTQ73RJH4WXRZE
- MLA
- Krc, Janez, et al. “Heterogenous Photonic Integration for Quantum Optical Communication.” 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN, IEEE, 2023, pp. 17–17, doi:10.1109/foan59927.2023.10328119.
- APA
- Krc, J., Debevc, A., Ljubotina, M., Topic, M., Luntadila Lufungula, I., De Witte, J., … Van Thourhout, D. (2023). Heterogenous Photonic Integration for Quantum Optical Communication. 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN, 17–17. https://doi.org/10.1109/foan59927.2023.10328119
- Chicago author-date
- Krc, Janez, Andraz Debevc, Milos Ljubotina, Marko Topic, Isaac Luntadila Lufungula, Jasper De Witte, Leonardo Midolo, et al. 2023. “Heterogenous Photonic Integration for Quantum Optical Communication.” In 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN, 17–17. IEEE. https://doi.org/10.1109/foan59927.2023.10328119.
- Chicago author-date (all authors)
- Krc, Janez, Andraz Debevc, Milos Ljubotina, Marko Topic, Isaac Luntadila Lufungula, Jasper De Witte, Leonardo Midolo, Claus Pedersen, Amir Hossein Ghadimi, Hamed Sattari, Michel Despont, Simone Ferrari, Wolfram Pernice, and Dries Van Thourhout. 2023. “Heterogenous Photonic Integration for Quantum Optical Communication.” In 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN, 17–17. IEEE. doi:10.1109/foan59927.2023.10328119.
- Vancouver
- 1.Krc J, Debevc A, Ljubotina M, Topic M, Luntadila Lufungula I, De Witte J, et al. Heterogenous Photonic Integration for Quantum Optical Communication. In: 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN. IEEE; 2023. p. 17–17.
- IEEE
- [1]J. Krc et al., “Heterogenous Photonic Integration for Quantum Optical Communication,” in 2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN, Ghent, Belgium, 2023, pp. 17–17.
@inproceedings{01HPEE9696RTFTQ73RJH4WXRZE,
abstract = {{Photonic integrated circuits (PICs) play an important role in telecom and datacom applications. While in the past integrated transceivers were the main driver for technological advances in integrated photonics, nowadays PICs are emerging in various other fields, such as sensing, high-performance computing, quantum technologies, and more [1]. Various material platforms for PICs have been developed and successfully utilized, like III-V semiconductors (InP, GaAs), silicon-based materials (Si, Si 3 N 4 , SiO 2 ), lithium niobate (LiNbO 3 ), polymers and others.}},
author = {{Krc, Janez and Debevc, Andraz and Ljubotina, Milos and Topic, Marko and Luntadila Lufungula, Isaac and De Witte, Jasper and Midolo, Leonardo and Pedersen, Claus and Ghadimi, Amir Hossein and Sattari, Hamed and Despont, Michel and Ferrari, Simone and Pernice, Wolfram and Van Thourhout, Dries}},
booktitle = {{2023 INTERNATIONAL WORKSHOP ON FIBER OPTICS ON ACCESS NETWORKS, FOAN}},
isbn = {{9798350319361}},
keywords = {{Photonic integrated circuit,Heterogeneous integration,Micro-transfer printing,Quantum technologies,Optical communication,Device-independent quantum key distribution}},
language = {{eng}},
location = {{Ghent, Belgium}},
pages = {{17--17}},
publisher = {{IEEE}},
title = {{Heterogenous Photonic Integration for Quantum Optical Communication}},
url = {{http://doi.org/10.1109/foan59927.2023.10328119}},
year = {{2023}},
}
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