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Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces

Filip Van Lysebetten, Tim Maiheu (UGent) , Johan Winne (UGent) and Filip Du Prez (UGent)
(2023) ADVANCED MATERIALS. 35(31).
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Abstract
On-demand adhesive dismantling has the potential to improve multimaterial product recycling, but its implementation has been hampered by a critical trade-off between strong bonding and easy debonding. As a result, the temperature range in which these temporary adhesives can be used is relatively limited. Here, a new class of dynamic epoxy resins is reported that significantly extends this upper temperature limit and still achieves fast debonding. Specifically, two types of dynamic polyamidoamine curing agents for epoxy hardening are developed, being polysuccinamides (PSA) and polyglutaramides (PGA). As the dynamic debonding/rebonding process of PSA and especially PGA linkages is more thermally demanding and at the same time more thermally robust than previously reported dynamic covalent systems, the resulting materials can be triggered at high temperatures, and at the same time remain bonded over a wide temperature range. The versatility of the PSA and PGA dynamic adhesive curing system is demonstrated in classical bulk adhesive formulations, as well as in dynamic covalent linking to a PSA- or PGA-functionalized surface. As a result, an attractive drop-in strategy is achieved for producing debondable and rebondable epoxy adhesives, with high complementarity to existing adhesive resin technologies and applicable in an industrially relevant temperature window.
Keywords
covalent adaptable networks, debondable adhesives, neighboring group participation, recyclable thermosets, REACTIVE POLYAMIDES, DICARBOXYLIC-ACID, CROSS-LINKING, TEMPERATURE, RELAXATION, POLYESTER, SYSTEMS, RESINS, CURE

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Citation

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MLA
Van Lysebetten, Filip, et al. “Epoxy Adhesives with Reversible Hardeners : Controllable Thermal Debonding in Bulk and at Interfaces.” ADVANCED MATERIALS, vol. 35, no. 31, 2023, doi:10.1002/adma.202300802.
APA
Van Lysebetten, F., Maiheu, T., Winne, J., & Du Prez, F. (2023). Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces. ADVANCED MATERIALS, 35(31). https://doi.org/10.1002/adma.202300802
Chicago author-date
Van Lysebetten, Filip, Tim Maiheu, Johan Winne, and Filip Du Prez. 2023. “Epoxy Adhesives with Reversible Hardeners : Controllable Thermal Debonding in Bulk and at Interfaces.” ADVANCED MATERIALS 35 (31). https://doi.org/10.1002/adma.202300802.
Chicago author-date (all authors)
Van Lysebetten, Filip, Tim Maiheu, Johan Winne, and Filip Du Prez. 2023. “Epoxy Adhesives with Reversible Hardeners : Controllable Thermal Debonding in Bulk and at Interfaces.” ADVANCED MATERIALS 35 (31). doi:10.1002/adma.202300802.
Vancouver
1.
Van Lysebetten F, Maiheu T, Winne J, Du Prez F. Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces. ADVANCED MATERIALS. 2023;35(31).
IEEE
[1]
F. Van Lysebetten, T. Maiheu, J. Winne, and F. Du Prez, “Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces,” ADVANCED MATERIALS, vol. 35, no. 31, 2023.
@article{01HAADWDZQAESYP8EHYW17R36D,
  abstract     = {{On-demand adhesive dismantling has the potential to improve multimaterial product recycling, but its implementation has been hampered by a critical trade-off between strong bonding and easy debonding. As a result, the temperature range in which these temporary adhesives can be used is relatively limited. Here, a new class of dynamic epoxy resins is reported that significantly extends this upper temperature limit and still achieves fast debonding. Specifically, two types of dynamic polyamidoamine curing agents for epoxy hardening are developed, being polysuccinamides (PSA) and polyglutaramides (PGA). As the dynamic debonding/rebonding process of PSA and especially PGA linkages is more thermally demanding and at the same time more thermally robust than previously reported dynamic covalent systems, the resulting materials can be triggered at high temperatures, and at the same time remain bonded over a wide temperature range. The versatility of the PSA and PGA dynamic adhesive curing system is demonstrated in classical bulk adhesive formulations, as well as in dynamic covalent linking to a PSA- or PGA-functionalized surface. As a result, an attractive drop-in strategy is achieved for producing debondable and rebondable epoxy adhesives, with high complementarity to existing adhesive resin technologies and applicable in an industrially relevant temperature window.}},
  articleno    = {{2300802}},
  author       = {{Van Lysebetten, Filip and Maiheu, Tim and Winne, Johan and Du Prez, Filip}},
  issn         = {{0935-9648}},
  journal      = {{ADVANCED MATERIALS}},
  keywords     = {{covalent adaptable networks,debondable adhesives,neighboring group participation,recyclable thermosets,REACTIVE POLYAMIDES,DICARBOXYLIC-ACID,CROSS-LINKING,TEMPERATURE,RELAXATION,POLYESTER,SYSTEMS,RESINS,CURE}},
  language     = {{eng}},
  number       = {{31}},
  pages        = {{11}},
  title        = {{Epoxy adhesives with reversible hardeners : controllable thermal debonding in bulk and at interfaces}},
  url          = {{http://doi.org/10.1002/adma.202300802}},
  volume       = {{35}},
  year         = {{2023}},
}
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