Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies
- Author
- Dries Bosman, Martijn Huynen (UGent) , Daniël De Zutter (UGent) , Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne and Dries Vande Ginste (UGent)
- Organization
- Abstract
- In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a novel strategy to handle the challenges associated with the evolution toward higher operating frequencies and integration densities. Consequently, it is imperative that the newly developed full-wave electromagnetic solvers rigorously model these innovative materials and still accurately capture phenomena such as the skin and proximity effect in good conductors. In this article, we propose such a method to rigorously characterize this important class of interconnects with arbitrary, possibly frequency-dependent, material properties, including combined dielectric and magnetic contrast. To that end, a 2-D differential surface admittance (DSA) operator is used, which invokes a single-source equivalence theorem to model both nonmagnetic and magnetic conductors efficiently. This operator is combined with the electric field integral equation (EFIE), yielding a comprehensive formalism to extract the pertinent per-unit-of-length (p.u.l.) resistance and inductance parameters of the modeled structures. The numerical properties of our technique are studied in detail, with particular attention to the influence of magnetic materials. Finally, various relevant application examples are considered to establish its correctness and versatility.
- Keywords
- TRANSMISSION-LINE PARAMETERS, INTEGRAL-EQUATION, LOSSY CONDUCTORS, SERIES IMPEDANCE, SKIN, Boundary integral equation (BIE), differential surface admittance (DSA), operator, interconnect modeling, magnetic materials, skin effect
Downloads
-
8268 acc.pdf
- full text (Accepted manuscript)
- |
- open access
- |
- |
- 1.08 MB
-
(...).pdf
- full text (Published version)
- |
- UGent only
- |
- |
- 7.85 MB
Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01GWH3AMZVDW5A6BB6BSWYCXVJ
- MLA
- Bosman, Dries, et al. “Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 71, no. 7, 2023, pp. 2794–806, doi:10.1109/TMTT.2023.3244205.
- APA
- Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., van der Plas, G., … Vande Ginste, D. (2023). Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 71(7), 2794–2806. https://doi.org/10.1109/TMTT.2023.3244205
- Chicago author-date
- Bosman, Dries, Martijn Huynen, Daniël De Zutter, Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne, and Dries Vande Ginste. 2023. “Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 71 (7): 2794–2806. https://doi.org/10.1109/TMTT.2023.3244205.
- Chicago author-date (all authors)
- Bosman, Dries, Martijn Huynen, Daniël De Zutter, Xiao Sun, Nicolas Pantano, Geert van der Plas, Eric Beyne, and Dries Vande Ginste. 2023. “Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies.” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES 71 (7): 2794–2806. doi:10.1109/TMTT.2023.3244205.
- Vancouver
- 1.Bosman D, Huynen M, De Zutter D, Sun X, Pantano N, van der Plas G, et al. Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES. 2023;71(7):2794–806.
- IEEE
- [1]D. Bosman et al., “Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies,” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, vol. 71, no. 7, pp. 2794–2806, 2023.
@article{01GWH3AMZVDW5A6BB6BSWYCXVJ,
abstract = {{In state-of-the-art interconnect design, topologies including magnetic materials, such as the so-called superlattice conductors, are rapidly emerging as a novel strategy to handle the challenges associated with the evolution toward higher operating frequencies and integration densities. Consequently, it is imperative that the newly developed full-wave electromagnetic solvers rigorously model these innovative materials and still accurately capture phenomena such as the skin and proximity effect in good conductors. In this article, we propose such a method to rigorously characterize this important class of interconnects with arbitrary, possibly frequency-dependent, material properties, including combined dielectric and magnetic contrast. To that end, a 2-D differential surface admittance (DSA) operator is used, which invokes a single-source equivalence theorem to model both nonmagnetic and magnetic conductors efficiently. This operator is combined with the electric field integral equation (EFIE), yielding a comprehensive formalism to extract the pertinent per-unit-of-length (p.u.l.) resistance and inductance parameters of the modeled structures. The numerical properties of our technique are studied in detail, with particular attention to the influence of magnetic materials. Finally, various relevant application examples are considered to establish its correctness and versatility.}},
author = {{Bosman, Dries and Huynen, Martijn and De Zutter, Daniël and Sun, Xiao and Pantano, Nicolas and van der Plas, Geert and Beyne, Eric and Vande Ginste, Dries}},
issn = {{0018-9480}},
journal = {{IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES}},
keywords = {{TRANSMISSION-LINE PARAMETERS,INTEGRAL-EQUATION,LOSSY CONDUCTORS,SERIES IMPEDANCE,SKIN,Boundary integral equation (BIE),differential surface admittance (DSA),operator,interconnect modeling,magnetic materials,skin effect}},
language = {{eng}},
number = {{7}},
pages = {{2794--2806}},
title = {{Analysis and application of a surface admittance operator for combined magnetic and dielectric contrast in emerging interconnect topologies}},
url = {{http://doi.org/10.1109/TMTT.2023.3244205}},
volume = {{71}},
year = {{2023}},
}
- Altmetric
- View in Altmetric
- Web of Science
- Times cited: