Digital image correlation for measuring full-field residual stresses in wire and arc additive manufactured components
- Author
- Dibakor Boruah (UGent) , Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde and Wim De Waele (UGent)
- Organization
- Abstract
- This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.
- Keywords
- General Materials Science, X-ray diffraction, wire plus arc additive manufacturing, residual stresses, digital image correlation, contour method, additive manufacturing
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Citation
Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-01GSWRXP2M7W9HHJ28AVE2WMX6
- MLA
- Boruah, Dibakor, et al. “Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components.” MATERIALS, vol. 16, no. 4, MDPI AG, 2023, doi:10.3390/ma16041702.
- APA
- Boruah, D., Dewagtere, N., Ahmad, B., Nunes, R., Tacq, J., Zhang, X., … De Waele, W. (2023). Digital image correlation for measuring full-field residual stresses in wire and arc additive manufactured components. MATERIALS, 16(4). https://doi.org/10.3390/ma16041702
- Chicago author-date
- Boruah, Dibakor, Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde, and Wim De Waele. 2023. “Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components.” MATERIALS 16 (4). https://doi.org/10.3390/ma16041702.
- Chicago author-date (all authors)
- Boruah, Dibakor, Nele Dewagtere, Bilal Ahmad, Rafael Nunes, Jeroen Tacq, Xiang Zhang, Hua Guo, Wim Verlinde, and Wim De Waele. 2023. “Digital Image Correlation for Measuring Full-Field Residual Stresses in Wire and Arc Additive Manufactured Components.” MATERIALS 16 (4). doi:10.3390/ma16041702.
- Vancouver
- 1.Boruah D, Dewagtere N, Ahmad B, Nunes R, Tacq J, Zhang X, et al. Digital image correlation for measuring full-field residual stresses in wire and arc additive manufactured components. MATERIALS. 2023;16(4).
- IEEE
- [1]D. Boruah et al., “Digital image correlation for measuring full-field residual stresses in wire and arc additive manufactured components,” MATERIALS, vol. 16, no. 4, 2023.
@article{01GSWRXP2M7W9HHJ28AVE2WMX6,
abstract = {{This study aims to demonstrate the capability of the digital image correlation (DIC) technique for evaluating full-field residual stresses in wire and arc additive manufactured (WAAM) components. Investigations were carried out on WAAM steel parts (wall deposited on a substrate) with two different wall heights: 24 mm and 48 mm. Mild steel solid wire AWS ER70S-6 was used to print WAAM walls on substrates that were rigidly clamped to H-profiles. DIC was used to monitor the bending deformation of WAAM parts during unclamping from the H-profiles, and residual stresses were calculated from the strain field captured during unclamping. Residual stresses determined from the proposed DIC-based method were verified with an analytical model and validated by the results from established residual stress measurement techniques, i.e., the contour method and X-ray diffraction.}},
articleno = {{1702}},
author = {{Boruah, Dibakor and Dewagtere, Nele and Ahmad, Bilal and Nunes, Rafael and Tacq, Jeroen and Zhang, Xiang and Guo, Hua and Verlinde, Wim and De Waele, Wim}},
issn = {{1996-1944}},
journal = {{MATERIALS}},
keywords = {{General Materials Science,X-ray diffraction,wire plus arc additive manufacturing,residual stresses,digital image correlation,contour method,additive manufacturing}},
language = {{eng}},
number = {{4}},
pages = {{19}},
publisher = {{MDPI AG}},
title = {{Digital image correlation for measuring full-field residual stresses in wire and arc additive manufactured components}},
url = {{http://doi.org/10.3390/ma16041702}},
volume = {{16}},
year = {{2023}},
}
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