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Micro-transfer printing for heterogeneous Si photonic integrated circuits

Günther Roelkens (UGent) , Jing Zhang (UGent) , Laurens Bogaert (UGent) , Maximilien Billet (UGent) , Dongbo Wang (UGent) , Biwei Pan (UGent) , Clemens Krückel (UGent) , Emadreza Soltanian (UGent) , Dennis Maes (UGent) , Tom Vanackere (UGent) , et al.
(2023) IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 29(3).
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Abstract
Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.
Keywords
Silicon, Photonics, Printing, Optical waveguides, Integrated optics, Substrates, III-V semiconductor materials, Integrated optoelectronics, photodiodes, printing, semiconductor lasers, silicon on insulator, technology, wafer-scale integration, waveguide components, SILICON, PHOTODIODES, EFFICIENT

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MLA
Roelkens, Günther, et al. “Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 29, no. 3, 2023, doi:10.1109/JSTQE.2022.3222686.
APA
Roelkens, G., Zhang, J., Bogaert, L., Billet, M., Wang, D., Pan, B., … Baets, R. (2023). Micro-transfer printing for heterogeneous Si photonic integrated circuits. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 29(3). https://doi.org/10.1109/JSTQE.2022.3222686
Chicago author-date
Roelkens, Günther, Jing Zhang, Laurens Bogaert, Maximilien Billet, Dongbo Wang, Biwei Pan, Clemens Krückel, et al. 2023. “Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 29 (3). https://doi.org/10.1109/JSTQE.2022.3222686.
Chicago author-date (all authors)
Roelkens, Günther, Jing Zhang, Laurens Bogaert, Maximilien Billet, Dongbo Wang, Biwei Pan, Clemens Krückel, Emadreza Soltanian, Dennis Maes, Tom Vanackere, Tom Vandekerckhove, Stijn Cuyvers, Jasper De Witte, Isaac Luntadila Lufungula, Xin Guo, He Li, Senbiao Qin, Grigorij Muliuk, Sarah Uvin, Bahawal Haq, Camiel Op de Beeck, Jeroen Goyvaerts, Guy Lepage, Peter Verheyen, Joris Van Campenhout, Geert Morthier, Bart Kuyken, Dries Van Thourhout, and Roel Baets. 2023. “Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits.” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS 29 (3). doi:10.1109/JSTQE.2022.3222686.
Vancouver
1.
Roelkens G, Zhang J, Bogaert L, Billet M, Wang D, Pan B, et al. Micro-transfer printing for heterogeneous Si photonic integrated circuits. IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. 2023;29(3).
IEEE
[1]
G. Roelkens et al., “Micro-transfer printing for heterogeneous Si photonic integrated circuits,” IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, vol. 29, no. 3, 2023.
@article{01GR0ZJRSRTEGJXNWWP1X7GSYS,
  abstract     = {{Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.}},
  articleno    = {{8200414}},
  author       = {{Roelkens, Günther and Zhang, Jing and Bogaert, Laurens and Billet, Maximilien and Wang, Dongbo and Pan, Biwei and Krückel, Clemens and Soltanian, Emadreza and Maes, Dennis and Vanackere, Tom and Vandekerckhove, Tom and Cuyvers, Stijn and De Witte, Jasper and Luntadila Lufungula, Isaac and Guo, Xin and Li, He and Qin, Senbiao and Muliuk, Grigorij and  Uvin, Sarah and  Haq, Bahawal and Op de Beeck, Camiel and Goyvaerts, Jeroen and  Lepage, Guy and  Verheyen, Peter and  Van Campenhout, Joris and Morthier, Geert and Kuyken, Bart and Van Thourhout, Dries and Baets, Roel}},
  issn         = {{1077-260X}},
  journal      = {{IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS}},
  keywords     = {{Silicon,Photonics,Printing,Optical waveguides,Integrated optics,Substrates,III-V semiconductor materials,Integrated optoelectronics,photodiodes,printing,semiconductor lasers,silicon on insulator,technology,wafer-scale integration,waveguide components,SILICON,PHOTODIODES,EFFICIENT}},
  language     = {{eng}},
  number       = {{3}},
  pages        = {{14}},
  title        = {{Micro-transfer printing for heterogeneous Si photonic integrated circuits}},
  url          = {{http://doi.org/10.1109/JSTQE.2022.3222686}},
  volume       = {{29}},
  year         = {{2023}},
}
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