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Microwave-enabled wearables : underpinning technologies, integration platforms, and next-generation roadmap

(2023) IEEE JOURNAL OF MICROWAVES. 3(1). p.193-226
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Abstract
This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the “interconnect” of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables.
Keywords
General Medicine, Additive manufacturing, antennas, backscattering, energy harvesting, E-textiles, flexible semiconductors, harmonic transponders, microwave, power transmission, MTT 70th Anniversary Special Issue, rectennas, printed electronics, RFID, RF sensing, sustainable electronics, wearable, electronics, WIRELESS POWER TRANSFER, SPLIT-RING-RESONATOR, COPLANAR WAVE-GUIDE, TEXTILE ANTENNA, RFID-TAG, ON-BODY, HARMONIC TRANSPONDER, LOW-PROFILE, FULL-DUPLEX, FDD RADIO

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MLA
Wagih, Mahmoud, et al. “Microwave-Enabled Wearables : Underpinning Technologies, Integration Platforms, and next-Generation Roadmap.” IEEE JOURNAL OF MICROWAVES, vol. 3, no. 1, 2023, pp. 193–226, doi:10.1109/jmw.2022.3223254.
APA
Wagih, M., Balocchi, L., Benassi, F., Carvalho, N. B., Chiao, J.-C., Correia, R., … Beeby, S. (2023). Microwave-enabled wearables : underpinning technologies, integration platforms, and next-generation roadmap. IEEE JOURNAL OF MICROWAVES, 3(1), 193–226. https://doi.org/10.1109/jmw.2022.3223254
Chicago author-date
Wagih, Mahmoud, Leonardo Balocchi, Francesca Benassi, Nuno B. Carvalho, Jung-Chih Chiao, Ricardo Correia, Alessandra Costanzo, et al. 2023. “Microwave-Enabled Wearables : Underpinning Technologies, Integration Platforms, and next-Generation Roadmap.” IEEE JOURNAL OF MICROWAVES 3 (1): 193–226. https://doi.org/10.1109/jmw.2022.3223254.
Chicago author-date (all authors)
Wagih, Mahmoud, Leonardo Balocchi, Francesca Benassi, Nuno B. Carvalho, Jung-Chih Chiao, Ricardo Correia, Alessandra Costanzo, Yepu Cui, Dimitra Georgiadou, Carolina Gouveia, Jasmin Grosinger, John S. Ho, Kexin Hu, Abiodun Komolafe, Sam Lemey, Caroline Loss, Gaetano Marrocco, Paul Mitcheson, Valentina Palazzi, Nicoletta Panunzio, Giacomo Paolini, Pedro Pinho, Josef Preishuber-Pflugl, Yasser Qaragoez, Hamed Rahmani, Hendrik Rogier, Jose Romero Lopera, Luca Roselli, Dominique Schreurs, Manos Tentzeris, Xi Tian, Russel Torah, Ricardo Torres, Patrick Van Torre, Dieff Vital, and Steve Beeby. 2023. “Microwave-Enabled Wearables : Underpinning Technologies, Integration Platforms, and next-Generation Roadmap.” IEEE JOURNAL OF MICROWAVES 3 (1): 193–226. doi:10.1109/jmw.2022.3223254.
Vancouver
1.
Wagih M, Balocchi L, Benassi F, Carvalho NB, Chiao J-C, Correia R, et al. Microwave-enabled wearables : underpinning technologies, integration platforms, and next-generation roadmap. IEEE JOURNAL OF MICROWAVES. 2023;3(1):193–226.
IEEE
[1]
M. Wagih et al., “Microwave-enabled wearables : underpinning technologies, integration platforms, and next-generation roadmap,” IEEE JOURNAL OF MICROWAVES, vol. 3, no. 1, pp. 193–226, 2023.
@article{01GQF0Z8HTRBTEN2JMAXT9W8Z8,
  abstract     = {{This paper presents a holistic and authoritative review of the role of microwave technologies in enabling a new generation of wearable devices. A human-centric Internet of Things (IoT) covering remote healthcare, distributed sensing, and consumer electronics, calls for high-performance wearable devices integrated into clothing, which require interdisciplinary research efforts to emerge. Microwaves, the “interconnect” of wireless networks, can enable, rather than solely connect, the next generation of autonomous, sustainable, and wearable-friendly electronics. First, enabling technologies including wireless power transmission and RF energy harvesting, backscattering and passive communication, RFID, and electromagnetic sensing are reviewed. We then discuss the key integration platforms, covering smart fabrics and electronic textiles, additive manufacturing, printed electronics, natively-flexible and organic RF semiconductors, and fully-integrated CMOS systems, where opportunities for hybrid integration are highlighted. The emerging research trends, from mmWave 6G, RF sensing and imaging, to healthcare applications including neural implants, drug delivery, and safety upon exposure to microwaves are re-visited and discussed, presenting a future roadmap for interdisciplinary research towards sustainable and reliable next-generation wearables.}},
  author       = {{Wagih, Mahmoud and Balocchi, Leonardo and Benassi, Francesca and Carvalho, Nuno B. and Chiao, Jung-Chih and Correia, Ricardo and Costanzo, Alessandra and Cui, Yepu and Georgiadou, Dimitra and Gouveia, Carolina and Grosinger, Jasmin and Ho, John S. and Hu, Kexin and Komolafe, Abiodun and Lemey, Sam and Loss, Caroline and Marrocco, Gaetano and Mitcheson, Paul and Palazzi, Valentina and Panunzio, Nicoletta and Paolini, Giacomo and Pinho, Pedro and Preishuber-Pflugl, Josef and Qaragoez, Yasser and Rahmani, Hamed and Rogier, Hendrik and Lopera, Jose Romero and Roselli, Luca and Schreurs, Dominique and Tentzeris, Manos and Tian, Xi and Torah, Russel and Torres, Ricardo and Van Torre, Patrick and Vital, Dieff and Beeby, Steve}},
  issn         = {{2692-8388}},
  journal      = {{IEEE JOURNAL OF MICROWAVES}},
  keywords     = {{General Medicine,Additive manufacturing,antennas,backscattering,energy harvesting,E-textiles,flexible semiconductors,harmonic transponders,microwave,power transmission,MTT 70th Anniversary Special Issue,rectennas,printed electronics,RFID,RF sensing,sustainable electronics,wearable,electronics,WIRELESS POWER TRANSFER,SPLIT-RING-RESONATOR,COPLANAR WAVE-GUIDE,TEXTILE ANTENNA,RFID-TAG,ON-BODY,HARMONIC TRANSPONDER,LOW-PROFILE,FULL-DUPLEX,FDD RADIO}},
  language     = {{eng}},
  number       = {{1}},
  pages        = {{193--226}},
  title        = {{Microwave-enabled wearables : underpinning technologies, integration platforms, and next-generation roadmap}},
  url          = {{http://doi.org/10.1109/jmw.2022.3223254}},
  volume       = {{3}},
  year         = {{2023}},
}

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