Project: Electircal analysis and compensation design for Gbps packaging interconnections

2009-01-01 – 2009-10-31

Abstract

In a sabbatical stay of 6 months a visiting professor from the National Taiwan University will be involved in a joint research project dealing with the modelling and optimisation of high speed packaging interconnects for Gbps applications. Model order reduction techniques will be used to come to compact models and optimised eye diagrams.