Project: Flexible electro-photonic integration platform
2014-01-01 – 2019-10-31
- Abstract
In this project we combine the expertise of three research groups in respectively photonic integrated circuits, electronic driver circuits and smart optical packaging techniques to realize a flexible platform for electro-photonic integration, for applications in communication, optical interconnects and consumer electronics.
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- Conference Paper
- C1
- open access
100 Gb/s duabinary elctro-absorption modulation of a heterogeneously integrated InP-on-Si DFB laser diode
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- Conference Paper
- C1
- open access
First real-time demonstration of 128 Gb/s PAM-4 transmission over 1 km SMF using a Si Photonics transmitter
(2018) p.1-3 -
- Journal Article
- A1
- open access
A novel broadband electro-absorption modulator based on bandfilling in n-InGaAs : design and simulations
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- Journal Article
- A1
- open access
DAC-less and DSP-free 112 Gb/s PAM-4 transmitter using two parallel electroabsorption modulators
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- Journal Article
- A1
- open access
Integration of high-speed GaAs metal-semiconductor-metal photodetectors by means of transfer printing for 850 nm wavelength photonic interposers
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- Journal Article
- A1
- open access
III–V-on-silicon C-band high-speed electro-absorption-modulated DFB laser
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- Journal Article
- A1
- open access
Real-time 100 Gb/s NRZ and EDB transmission with a GeSi electroabsorption modulator for short-reach optical interconnects
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- Journal Article
- A1
- open access
43 Gb/s NRZ-OOK direct modulation of a heterogeneously integrated InP/Si DFB laser