dr. ir. Tom Sterken
No current affiliation with UGent
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Development of a stretchable circuit and its integration method on knit fabrics for lower back injury prevention
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- Journal Article
- A1
- open access
PIXAPP photonics packaging pilot line development of a silicon photonic optical transceiver with pluggable fiber connectivity
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- Journal Article
- A1
- open access
Development and washing reliability testing of a stretchable circuit on knit fabric
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3D heterogeneous package integration of air/magnetic core inductor : 89% efficiency buck converter with backside power delivery network
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Integrated magnetic cores in FOWLP and their applications
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- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
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- Conference Paper
- C3
- open access
Technology development for a flexible, low-cost backplane for lighting applications
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- Journal Article
- A1
- open access
High yield fabrication process for 3D-stacked ultra-thin chip packages using photo-definable polyimide and symmetry in packages
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Laboratory validation of MEMS-based sensors for post-earthquake damage assessment
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- Conference Paper
- C3
- open access
Adhesion test for UTCP structure in humid environment