Stevan Stanković
No current affiliation with UGent
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III-V/silicon photonic integrated circuits for communication and sensing applications
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- Conference Paper
- C1
- open access
DVS-BCB adhesive bonding for silicon photonics
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Heterogeneous III-V/silicon photonic integrated circuits
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- PhD Thesis
- open access
Hybrid III-V/Si DFB lasers based on polymer bonding technology
(2013) -
- Journal Article
- A1
- open access
Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate
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In search for the ideal hybrid silicon laser
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- Journal Article
- A1
- open access
Hybrid III-V/Si distributed-feedback laser based on adhesive bonding
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- Conference Paper
- P1
- open access
Hybrid silicon lasers for optical interconnect
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- Conference Paper
- C3
- open access
Multiple die-to-wafer adhesive bonding for heterogeneous integration
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- Conference Paper
- C3
- open access
III-V-on-silicon membrane photonics for near-infrared and mid-infrared apllications