Academic Bibliography

Search 200 years of publications by Ghent University researchers.

dr. ir. Frederick Bossuyt

Faculty of Engineering and Architecture > Department of Electronics and information systems

Work address: Technologiepark Zwijnaarde 126
9052 Zwijnaarde
Email: Frederick.Bossuyt@UGent.be
ORCID iD: 0000-0003-3350-9295

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The integration of electronic circuits in plastics using injection technologies : a literature review

Mona Bakr (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) FLEXIBLE AND PRINTED ELECTRONICS. 7(2).
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- Journal Article
- A1
- open access
Testing for wearability and reliability of TPU lamination method in e-textiles

Paula Veske (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2022) SENSORS. 22(1).
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- Conference Paper
- C1
- open access
Over-molding of two-dimensional curved shape using polyimide copper cladding foil

Mona Bakr (UGent) , Yibo Su, Ali Rezaei, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2021) 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC).
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Over-molding of flexible polyimide-based electronic circuits

Mona Bakr (UGent) , Yibo Su, Ali Rezaei, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2021) FLEXIBLE AND PRINTED ELECTRONICS. 6(2).
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- Journal Article
- A1
- open access
Development and washing reliability testing of a stretchable circuit on knit fabric

Paula Veske (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Tom Sterken (UGent) and Jan Vanfleteren (UGent)

(2020) APPLIED SCIENCES-BASEL. 10(24).
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- Conference Paper
- C1
- open access
Flexible microsystems using over-molding technology

Mona Bakr (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) and Yibo Su

(2020) PROCEDIA MANUFACTURING. 52. p.26-31
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- Conference Paper
- P1
- open access
Vacuum lamination of a stretchable sensor system in polypropylene

Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Patrick Deckers and Jan Vanfleteren (UGent)

(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
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Solar cells integration in over-molded printed electronics

Mona Bakr (UGent) , Pieter Bauwens (UGent) , Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Imen Chtioui and Wim Christiaens

(2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Proceedings.
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- Conference Paper
- P1
- open access
Effect of overmolding process on the integrity of electronic circuits

Mona Bakr (UGent) , Yibo Su, Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2019) 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). In European Microelectronics Packaging Conference
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- Journal Article
- A1
- open access
Stretchable mould interconnect optimization : peeling automation and carrierless techniques

Bart Plovie (UGent) , Yang Yang, Sheila Dunphy (UGent) , Kristof Dhaenens (UGent) , Steven Van Put (UGent) , Frederick Bossuyt (UGent) and Jan Vanfleteren (UGent)

(2019) IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 9(5). p.955-962

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