dr. ir. Frederick Bossuyt
- Work address
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Technologiepark Zwijnaarde 126
9052 Zwijnaarde - Frederick.Bossuyt@UGent.be
- ORCID iD
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0000-0003-3350-9295
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The integration of electronic circuits in plastics using injection technologies : a literature review
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- Journal Article
- A1
- open access
Testing for wearability and reliability of TPU lamination method in e-textiles
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- Conference Paper
- C1
- open access
Over-molding of two-dimensional curved shape using polyimide copper cladding foil
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Over-molding of flexible polyimide-based electronic circuits
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- Journal Article
- A1
- open access
Development and washing reliability testing of a stretchable circuit on knit fabric
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- Conference Paper
- C1
- open access
Flexible microsystems using over-molding technology
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- Conference Paper
- P1
- open access
Vacuum lamination of a stretchable sensor system in polypropylene
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Solar cells integration in over-molded printed electronics
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- Conference Paper
- P1
- open access
Effect of overmolding process on the integrity of electronic circuits
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- Journal Article
- A1
- open access
Stretchable mould interconnect optimization : peeling automation and carrierless techniques