Wim Christiaens

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal Priyabadini (UGent) , An Gielen (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Steven Van Put (UGent) , Gerhard Kunkel, Anders Erik Petersen and Jan Vanfleteren (UGent)

(2011) 44th International Symposium on Microelectronics, Proceedings. p.463-468

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Design and implementation of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens (UGent) , Yung-Yu Hsu, François Iker, Frederick Bossuyt (UGent) , Jan Vanfleteren (UGent) , Olaf van der Sluis and PHM Timmermans

(2011) MICROELECTRONICS RELIABILITY. 51(6). p.1069-1076

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A Reliable and comfortable package for wearable medical devices

Tom Sterken (UGent) , Jan Vanfleteren (UGent) , Frederick Bossuyt (UGent) , Steven Brebels, Wim Christiaens (UGent) , Thomas Vervust (UGent) , Michal Jablonski (UGent) , Sheila Dunphy (UGent) , Filip Vermeiren (UGent) , Yung-yu Hsu, et al.

(2011) Microelectronic packaging for medical and Hi-Rel devices, Abstracts.

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Book Chapter

System-in-foil technology

Andreas Dietzel, Jeroen van den Brand, Jan Vanfleteren (UGent) , Wim Christiaens (UGent) , Erwin Bosman (UGent) and Johan De Baets (UGent)

(2011) Ultra-thin chip technology and applications. p.141-157

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Module miniaturization by ultra thin package stacking

Thomas Loeher, David Schuetze, Wim Christiaens (UGent) , Kristof Dhaenens (UGent) , Swarnakamal Priyabadini (UGent) , Andreas Ostmann and Jan Vanfleteren (UGent)

(2010) 2010 3rd electronic system-integration technology conference (ESTC 2010). p.1-5

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