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- Journal Article
- A1
- open access
Developing an advanced module for back-contact solar cells
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Performance of a new type of module based on back-contact solar cells
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Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
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Technology Development and Characterization forInterconnecting Driver Electronic Circuitry to Flat-PanelDisplays.
(2009) -
Fabrication processes for embedding thin chips in flat flexible substrates
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Ultra thin chip packaging (UTCP): a promising technology for future flexible display interconnection
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Assembly of Ultra-Thin Chip Packages (UTCPs) for enhanced flexibility of flexible displays
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- Conference Paper
- P1
- open access
Multiple chip integration for flat flexible electronics
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Interconnecting drivers to flexible displays
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Embedding of thinned chips in plastic substrates