dr. ir. Maarten Cauwe
- Work address
-
Technologiepark Zwijnaarde 126
9052 Zwijnaarde - Maarten.Cauwe@UGent.be
- ORCID iD
-
0000-0002-6413-998X
Show
Sort by
-
Advanced PCB technologies for space and their assessment using up-to-date standards
-
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
-
- Journal Article
- A1
- open access
Cost-effective high-performance air-filled SIW antenna array for the global 5G 26 GHz and 28 GHz bands
-
- Journal Article
- A2
- open access
High-density interconnect technology assessment of printed circuit boards for space applications
-
- Conference Paper
- C3
- open access
The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
-
- Journal Article
- A1
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
-
Development of an active high-density transverse intrafascicular micro-electrode probe
-
FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
-
- Journal Article
- A1
- open access
Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants
-
Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3