dr. ir. Maarten Cauwe
- Work address
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Technologiepark Zwijnaarde 126
9052 Zwijnaarde - Maarten.Cauwe@UGent.be
- ORCID iD
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0000-0002-6413-998X
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High-density interconnect technology assessment of printed circuit boards for space applications
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- Conference Paper
- C3
- open access
The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
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- Journal Article
- A1
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
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Development of an active high-density transverse intrafascicular micro-electrode probe
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FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
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- Journal Article
- A1
- open access
Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants
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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
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- Journal Article
- A1
- open access
Dual-band (28,38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems
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Novel broadband transition for rectangular dielectric waveguide to planar circuit board at D band
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A PCB-embedding scheme for LCP ribbon waveguide at D-band