Academic Bibliography

Search 200 years of publications by Ghent University researchers.

Lieven Degrendele

Faculty of Engineering and Architecture > Department of Electronics and information systems

Work address: Technologiepark Zwijnaarde 126
9052 Zwijnaarde
Email: Lieven.Degrendele@UGent.be

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3D multifunctional composites based on large-area stretchable circuit with thermoforming technology

Yang Yang (UGent) , Thomas Vervust (UGent) , Sheila Dunphy (UGent) , Steven Van Put (UGent) , Bjorn Vandecasteele (UGent) , Kristof Dhaenens (UGent) , Lieven Degrendele (UGent) , Lothar Mader (UGent) , Linde De Vriese, Tom Martens, et al.

(2018) ADVANCED ELECTRONIC MATERIALS. 4(8).
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Four-point bending cycling : the alternative for thermal cycling solder fatigue testing of electronic components

Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele (UGent) , Johan De Baets (UGent) , Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie and Geert Willems

(2017) MICROELECTRONICS RELIABILITY. 74. p.131-135
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How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

Bart Vandevelde, Lieven Degrendele (UGent) , Maarten Cauwe (UGent) , Bart Allaert, Ralf Lauwaert and Geert Willems

(2016) International Conference on Electronics Packaging. p.94-98
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- Conference Paper
- C1
- open access
Reduced 2nd level solder joint life time of low-CTE mold compound packages

Bart Vandevelde, Riet Labie, Geert Willems, Lieven Degrendele (UGent) , Maarten Cauwe (UGent) and Johan De Baets (UGent)

(2014) 5th Electronic Materials, Processes and Packaging for Space, Proceedings.
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- Conference Paper
- C3
In situ monitoring of urine and sweat contamination in bed linen

Bjorn Van Keymeulen (UGent) , Lieven Degrendele (UGent) , Frederick Bossuyt (UGent) and Johan De Baets (UGent)

(2013) European congress on Innovations in Textiles for Health Care, Abstracts.
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- Conference Paper
- C1
A flexible polyimide based circuit for rapid heating of small objects

Bjorn Vandecasteele (UGent) , Kristof Dhaenens (UGent) , Wim Christiaens (UGent) , Lieven Degrendele (UGent) , M STEEL, A VAN LIERE and Jan Vanfleteren (UGent)

(2006) Proceedings of IMAPS Nordic. p.70-74
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- Journal Article
- A1
Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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- Conference Paper
- P1
Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers : overplating reliability considerations for the solder mask

Sam Siau, Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2003) 26TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, CONFERENCE PROCEEDINGS. p.158-162