prof. dr. ir. Peter Ossieur

Journal Article
A1
open access

56-Gb/s 3D-integrated silicon optical transmitter based on micro-transfer printing

Tinus Pannier (UGent) , He Li (UGent) , Ye Gu (UGent) , Xin Wang (UGent) , Prasanna Ramaswamy, Ruggero Loi, Patrick Heise, Senbiao Qin (UGent) , Biwei Pan (UGent) , Jing Zhang (UGent) , et al.

(2026) OPTICS EXPRESS. 34(11). p.20833-20842

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Journal Article
A1
open access

APD receiver co-optimization for chip-to-chip communication on 3D/2.5D photonic interposers

Aimen Zelaci (UGent) , Amir Khaled Abdelhamid Mohamed Shahin (UGent) , Xin Wang (UGent) , Conor Coughlan, Peter De Heyn (UGent) , Dimitrios Velenis, Joris Van Campenhout, Dries Van Thourhout (UGent) , Nicolas Pantano and Peter Ossieur (UGent)

(2026) JOURNAL OF LIGHTWAVE TECHNOLOGY. 44(12). p.5048-5058

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360 Gbps Ge-on-Si avalanche photodiodes operating in the O- and C-band

Amir Khaled Abdelhamid Mohamed Shahin (UGent) , Conor Coughlan, Cédric Bruynsteen (UGent) , Mathias Berciano, Didit Yudistira, Roger Loo (UGent) , Hakim Kobbi, Leandro Da Silva (UGent) , Nishant Singh (UGent) , Peter Verheyen, et al.

(2026) 2026 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC.

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A Ge/Si photodiode exceeding 110 GHz with 0.9 A/W, low capacitance and operating at -0.5 V for O and C-band applications

Conor Coughlan, Amir Khaled Abdelhamid Mohamed Shahin (UGent) , Mathias Berciano, Hakim Kobbi, Shalini Shalini Jakanadan, Roger Loo (UGent) , Cédric Bruynsteen (UGent) , Jakob Declercq (UGent) , Minkyu Kim, Swetansu Bipul, et al.

(2026) 2026 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC.

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Journal Article
A1
open access

Small-signal system-level analysis of traveling-wave Mach-Zehnder modulators

Tinus Pannier (UGent) , Lucas Van Severen (UGent) , Marijn Werbrouck (UGent) and Peter Ossieur (UGent)

(2026) OPTICS EXPRESS. 34(8). p.14445-14464

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A 25 GBd co-integration demonstration of wafer-scale graphene modulator and BiCMOS driver

Tom Reep (UGent) , Kieran De Bruyn (UGent) , Cheng-Han Wu, Jasper Jans (UGent) , Joris Van Kerrebrouck (UGent) , Yishu Huang (UGent) , Yujie Guo (UGent) , Didit Yudistira, Steven Brems, Inge Asselberghs, et al.

(2026) 2D MATERIALS. 13(2).

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Advanced 2.5D co-packaged optical solutions for high-efficiency AI workloads and cloud computing : delivering 6.4 Tb/s per port, towards 204Tb/s switch-ASICS

B. Sirbu, D. Hernandez Solarte, B. Chowdhury, M. Symeonidis, M. Anastasiadis, A. Palaci, Jonas De Busscher (UGent) , Peter Ossieur (UGent) and T. Tekin

(2026) OPTICAL INTERCONNECTS AND PACKAGING 2026. In Proceedings of SPIE 13903. p.1-5

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Journal Article
A1
open access

A 7-bit 150-GSa/s DAC in 5-nm FinFET CMOS

Bart Moeneclaey (UGent) , Joris Lambrecht (UGent) , Angelo Parisi, Joris Van Kerrebrouck (UGent) , Gertjan Coudyzer (UGent) , Anirudh Kankuppe, Xin Yin (UGent) , Ewout Martens, Jan Craninckx and Peter Ossieur (UGent)

(2026) IEEE JOURNAL OF SOLID-STATE CIRCUITS. 61(4). p.1363-1373

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Silicon photonics modulators and photodetectors for next-generation CPO and optical I/O

J. Van Campenhout, M. Kim, C. Coughlan, Amir Khaled Abdelhamid Mohamed Shahin (UGent) , Z. Ahmad, Cédric Bruynsteen (UGent) , Leandro Da Silva (UGent) , Nishant Singh (UGent) , D. Malik, G. Muliuk, et al.

(2025) 2025 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM. In IEEE International Electron Devices Meeting

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Conference Paper
P1
open access

Electronic-photonic integrated circuits through micro-transfer printing

He Li (UGent) , Tinus Pannier, Ye Gu, Ruggero Loi, Prasanna Ramaswamy, Patrick Steglich, Biwei Pan (UGent) , Jing Zhang (UGent) , Peter Ossieur (UGent) and Günther Roelkens (UGent)

(2025) 2025 IEEE SILICON PHOTONICS CONFERENCE, SIPHOTONICS. In IEEE International Conference on Group IV Photonics

Academic Bibliography

prof. dr. ir. Peter Ossieur

56-Gb/s 3D-integrated silicon optical transmitter based on micro-transfer printing

APD receiver co-optimization for chip-to-chip communication on 3D/2.5D photonic interposers

360 Gbps Ge-on-Si avalanche photodiodes operating in the O- and C-band

A Ge/Si photodiode exceeding 110 GHz with 0.9 A/W, low capacitance and operating at -0.5 V for O and C-band applications

Small-signal system-level analysis of traveling-wave Mach-Zehnder modulators

A 25 GBd co-integration demonstration of wafer-scale graphene modulator and BiCMOS driver

Advanced 2.5D co-packaged optical solutions for high-efficiency AI workloads and cloud computing : delivering 6.4 Tb/s per port, towards 204Tb/s switch-ASICS

A 7-bit 150-GSa/s DAC in 5-nm FinFET CMOS

Silicon photonics modulators and photodetectors for next-generation CPO and optical I/O

Electronic-photonic integrated circuits through micro-transfer printing

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