- Work address
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Krijgslaan 281, S1
9000 Gent - Diederik.Depla@UGent.be
- ORCID iD
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0000-0001-6606-2480
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- Journal Article
- open access
Effect of processing conditions on residual stress in sputtered transition metal nitrides (TiN, ZrN and TaN): Experiments and modeling
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A computational study of the double hysteresis phenomenon during reactive sputtering
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Plasma-enhanced atomic layer deposition : correlating O2 plasma parameters and species to blister formation and conformal film growth
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- Journal Article
- A1
- open access
Influence of impurities on the front velocity of sputter deposited Al/CuO thermite multilayers
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- Journal Article
- A1
- open access
Understanding residual stress in thin films : analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model
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- Journal Article
- A1
- open access
The growth of a multi-principal element (CoCrFeMnNi) oxynitride film by direct current magnetron sputtering using air as reactive gas
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Nitride formation during reactive sputter deposition of multi-principal element alloys in argon/nitrogen mixtures
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On the grain size-thickness correlation for thin films
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- Journal Article
- A1
- open access
Sputter deposited metal layers embedded in composites : from fundamentals to applications
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Sputter deposition with powder targets : an overview