Academic Bibliography

Search 200 years of publications by Ghent University researchers.

ereprof. dr. Alfons Vervaet

Email: Alfons.Vervaet@UGent.be

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XPS-study of Cu/epoxy Interfaces after different Wet Chemical Treatments

Sam Siau, B DE ROO and Alfons Vervaet (UGent)

(2007) 211th ECS Meeting - Chicago, Illinois F1 - Electrochemical Processing in ULSI and MEMS 3-Electrodeposition.
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Study of the failure mechanism of the Cu/epoxy interface after modifications by means of surface chemical reactions

Sam Siau and Alfons Vervaet (UGent)

(2006) ECS Transactions. 3(21). p.123-132
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Improvement of copper adhesion by chemical modification of epoxy surfaces.

B DE ROO, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , An Gielen (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) 7e FirW Doctoraatssymposium, papers.
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- Journal Article
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Optimization of microvia-technology using excimer laser for build-up layer application in microelectronics

Alfons Vervaet (UGent) , Sam Siau, Johan De Baets (UGent) and Boniface Manirambona (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(23). p.8243-8250
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Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Sam Siau, Alfons Vervaet (UGent) , Lieven Degrendele (UGent) , Johan De Baets (UGent) and André Van Calster (UGent)

(2006) APPLIED SURFACE SCIENCE. 252(8). p.2717-2740
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Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2006) THIN SOLID FILMS. 495(1-2). p.348-356
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- Conference Paper
- C3
Epoxy polymer surface modification through wet-chemical organic surface synthesis for adhesion improvement in microelectronics

SABINE SIAU (UGent) , Alfons Vervaet (UGent) , André Van Calster (UGent) , Etienne Schacht (UGent) and Ulric Demeter (UGent)

(2005) Proceedings E-MRS 2005 Spring Meeting Strassbourg. p.E37-E38
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The Development of Epoxy Polymer Surface Roughness Due to Wet Chemical Treatments and its Relevance to Adhesion of Electrochemically Deposited Copper

Sam Siau, Alfons Vervaet (UGent) , André Van Calster (UGent) and Daniël Baert

(2005) Program of the Fifth International Symposium on Polymer Surface Modification. p.22-22
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- C3
Interface evolution of epoxy layers due to wetchemical treatments and its relevance to adhesion of electrochemically deposited copper

Sam Siau, Alfons Vervaet (UGent) , Etienne Schacht (UGent) and André Van Calster (UGent)

(2005) Meeting abstracts of the 207th Meeting 2005 The Electrochemical Society.. p.348-348
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Adhesion strength of the epoxy polymer/copper interface for use in microelectronics

Sam Siau, Alfons Vervaet (UGent) , L VAN VAECK, Etienne Schacht (UGent) , Ulric Demeter (UGent) and André Van Calster (UGent)

(2005) JOURNAL OF THE ELECTROCHEMICAL SOCIETY. 152(6).

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