- ORCID iD
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0000-0002-5574-2808
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- Conference Paper
- C3
- open access
The use of ALD layers for hermetic encapsulation in the development of a flexible implantable micro electrode for neural recording and stimulation
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- PhD Thesis
- open access
Long-term miniaturized flexible hermetic encapsulation for implantable medical devices using polymers and atomic layer deposited ceramics
(2020) -
- Journal Article
- A1
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for the encapsulation of implantable medical devices
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FITEP : a Flexible Implantable Thin Electronic Package platform for long term implantation applications, based on polymer and ceramic ALD multilayers
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- Journal Article
- A1
- open access
Ultra-long-term reliable encapsulation using an atomic layer deposited Hfo2/Al2o3/Hfo2 triple-interlayer for biomedical implants
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- Conference Paper
- C3
- open access
Accelerated hermeticity testing of biocompatible moisture barriers used for encapsulation of implantable medical devices
(2017) p.1-1 -
- Conference Paper
- C3
- open access
Superior moisture barrier properties of CMOS passivation stacks by the use of plasma-densified oxides