Behnam Madadnia
Show
Sort by
-
- Journal Article
- A1
- open access
Methods to improve accuracy of electronic component positioning in thermoformed electronics
-
- Journal Article
- A1
- open access
Parameter study on force curves of assembled electronic components on foils during injection overmolding using simulation
-
Design and technology for accurate component positioning in 3D thermoformed electronics
(2023) -
A novel method for component positioning in thermoformed electronics
-
Using Grubler's Criterion theory to position the electronic components in thermoformed electronics
-
- Journal Article
- A1
- open access
Process optimization of injection overmolding structural electronics with regard to film distortion
-
Innovative component positioning method for thermoformed electronics
-
Using non-stretchable structures for component positioning in thermoformed electronics
-
- Journal Article
- A1
- open access
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
-
Reducing out-of-plane deformation of metal interconnects in structural electronics