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- Journal Article
- A1
- open access
Methods to improve accuracy of electronic component positioning in thermoformed electronics
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- Journal Article
- A1
- open access
Parameter study on force curves of assembled electronic components on foils during injection overmolding using simulation
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Design and technology for accurate component positioning in 3D thermoformed electronics
(2023) -
A novel method for component positioning in thermoformed electronics
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Using Grubler's Criterion theory to position the electronic components in thermoformed electronics
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- Journal Article
- A1
- open access
Process optimization of injection overmolding structural electronics with regard to film distortion
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Innovative component positioning method for thermoformed electronics
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Using non-stretchable structures for component positioning in thermoformed electronics
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- Journal Article
- A1
- open access
Technological development for the reduction of out-of-plane deformation of metallic meander structures in thermoformed electronics
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Reducing out-of-plane deformation of metal interconnects in structural electronics