- ORCID iD
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0000-0002-3337-5955
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Fully integrated flexible dielectric monitoring sensor system for real-time in situ prediction of the degree of cure and glass transition temperature of an epoxy resin
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- Journal Article
- A1
- open access
Stretchable mould interconnect optimization : peeling automation and carrierless techniques
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- PhD Thesis
- open access
Thermoplastic electronic circuits : design, technology and characterisation
(2019) -
Design automation of meandered interconnects for stretchable circuits
(2019) IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS. 38(9). p.1648-1660 -
Design and Integration of Flexible Sensor Matrix for in Situ Monitoring of Polymer Composites
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- Journal Article
- A1
- open access
Stretchability : the metric for stretchable electrical interconnects
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- Conference Paper
- C3
- open access
One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology
(2017) -
- Conference Paper
- C3
- open access
Fabrication of fixed-shape soft smart objects by thermoplastic forming of flat stretchable circuits
(2017) -
- Conference Paper
- C3
- open access
Thermoplastically Shaped Wearable Medical Devices
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- Conference Paper
- C1
- open access
Flex PCB based technology for randomly shaped circuits