- ORCID iD
- 0000-0003-1623-6248
Show
Sort by
-
- Journal Article
- A1
- open access
Parameter study on force curves of assembled electronic components on foils during injection overmolding using simulation
-
- PhD Thesis
- open access
Integration of electronics in plastics using injection molding processes
(2022) -
- Journal Article
- A1
- open access
A study on over-molded copper-based flexible electronic circuits
-
The integration of electronic circuits in plastics using injection technologies : a literature review
-
- Conference Paper
- C1
- open access
Over-molding of two-dimensional curved shape using polyimide copper cladding foil
-
Over-molding of flexible polyimide-based electronic circuits
-
- Conference Paper
- P1
- open access
Flexible microsystems using over-molding technology
-
Solar cells integration in over-molded printed electronics
-
- Conference Paper
- P1
- open access
Effect of overmolding process on the integrity of electronic circuits